Base anterial:Ceramic-filled Laminates Reinforced with Woven Fiberglass
Layer count:Double Layer, Multilayer, Hybrid PCB
PCB thickness:10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
Base material:TMM4 1.524mm
Layer count:2 layers
PCB thickness:1.6 mm ±0.16
PCB material:RT/duroid 6202
Layer count:2-layer
PCB thickness:0.2mm
PCB material:RT/duroid 5880
Layer count:2-layer
PCB thickness:0.45mm
PCB material:RO4350B
Layer count:2-layer
PCB thickness:0.5mm
PCB material:RO4725JXR
Layer count:2-layer
PCB thickness:0.8mm
PCB material:RO4003C
Layer count:2-layer
PCB thickness:0.5mm
PCB material:RT/duroid 5880 / RO4450F
Layer count:4 layers
PCB thickness:3.0mm
PCB material:RO4533
Layer count:2 layers
PCB thickness:0.6mm
PCB material:RO4003C /RO4450F
Layer count:3 layers
PCB thickness:1.82mm
Material de los PCB:RT/duroid 5880 - 1.575 mm (62mil)
Número de capas:de tres capas
espesor de los PCB:3,3 mm
Material de los PCB:RO4830 más núcleo - 5 mil (0,127 mm)
Número de capas:2-layer
espesor de los PCB:0.2 mm