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IsoClad 933 PCB Substrate Copper Clad Laminate Sheet
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IsoClad 933 PCB Substrate Copper Clad Laminate Sheet
  • Nombre

IsoClad 933 PCB Substrate Copper Clad Laminate Sheet

Cuota De Producción: 1 Uds.
Precio: USD9.99-99.99
Embalaje Estándar: Bolsas de vacío + cajas de cartón
Período De Entrega: 8-9 días laborables
Método De Pago: T/T
Capacidad De Suministro: 5000 unidades por mes
Detalles Información
Descripción del Producto
Información detallada
Lugar de origen
Porcelana
Nombre de la marca
Bicheng
Certificación
UL, ISO9001, IATF16949
Número de modelo
BIC-332.V1.0
Número de pieza:
El ISOClad 933
Espesor del laminado:
0,381 mm 0,787 mm 1,575 mm
Tamaño laminado:
305X460mm(12X18''); 24X18''(610X457mm)
Peso de cobre:
0,5 oz (0,018 mm), 1 oz (0,035 mm);
Resaltar:

IsoClad 933 PCB substrate

,

copper clad laminate sheet

,

PCB substrate with warranty

Descripción del Producto

IsoClad® 933 laminates are nonwoven fiberglass-reinforced PTFE composite materials tailored for deployment as printed circuit board (PCB) substrates. The nonwoven reinforcement architecture imparts enhanced flexural capability, making these laminates ideally suited for applications requiring post-fabrication circuit bending—conformal or “wrap-around” antennas represent a prime use case for this attribute.


Unlike standard nonwoven fiberglass/PTFE alternatives, IsoClad series laminates incorporate longer randomly oriented fibers and leverage a proprietary manufacturing process to deliver superior dimensional stability and enhanced dielectric constant (Dk) uniformity, even when compared to competitive products with equivalent dielectric constant values.


With a dielectric constant (Er) of 2.33, IsoClad 933 laminates utilize a higher fiberglass-to-PTFE ratio to form a highly reinforced composite structure. This optimized formulation achieves improved dimensional stability alongside elevated mechanical strength, without compromising core electrical performance.

 

IsoClad 933 PCB Substrate Copper Clad Laminate Sheet 0


Features

  • Nonwoven fiberglass reinforcement
  • Low dielectric constant (Er = 2.33)
  • Ultra-low signal loss


Benefits

  • Reduced rigidity versus woven fiberglass-reinforced laminates
  • Exceptional isotropy across the X, Y, and Z axes


Typical Applications

  • Conformal antennas
  • Stripline and microstrip circuits
  • Missile guidance systems
  • Radar and electronic warfare systems

 

Property Test Method Condition IsoClad 933
Dielectric Constant @ 10 GHz IPC TM-650 2.5.5.5 C23/50 2.33
Dissipation Factor @ 10 GHz IPC TM-650 2.5.5.5 C23/50 0.0016
Thermal Coefficient of Er (ppm/°C) IPC TM-650 2.5.5.5 (Adapted) -10°C to +140°C -132
Peel Strength (lbs.per inch) IPC TM-650 2.4.8 After Thermal 10
Volume Resistivity (MΩ-cm) IPC TM-650 2.5.17.1 C96/35/90 3.5 x 10⁸
Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 1.0 x 10⁸
Arc Resistance (seconds) ASTM D-495 D48/50 >180
Tensile Modulus (kpsi) ASTM D-638 A, 23°C 173, 147
Tensile Strength (kpsi) ASTM D-882 A, 23°C 6.8, 5.3
Compressive Modulus (kpsi) ASTM D-695 A, 23°C 197
Flexural Modulus (kpsi) ASTM D-790 A, 23°C 239
Dielectric Breakdown (kV) ASTM D-149 D48/50 >45
Density (g/cm³) ASTM D-792 (Method A) A, 23°C 2.27
Water Absorption (%) MIL-S-13949H 3.7.7; IPC TM-650 2.6.2.2 E1/105 + D24/23 0.05
Coefficient of Thermal Expansion (ppm/°C) IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer 0°C to 100°C X Axis: 31
Y Axis: 47 Y Axis: 35    
Z Axis: 236 Z Axis: 203    
Thermal Conductivity (W/mK) ASTM E-1225 100°C 0.263
Outgassing Requirements 125°C, ≤10⁻⁶ torr -  
Total Mass Loss (%) Maximum 1.00% 125°C, ≤10⁻⁶ torr 0.03
Collected Volatile Condensable Material (%) Maximum 0.10% 125°C, ≤10⁻⁶ torr 0.00
Water Vapor Regain (%) - 125°C, ≤10⁻⁶ torr 0.02
Visible Condensate ± 125°C, ≤10⁻⁶ torr NO
Flammability UL 94 Vertical Burn; IPC TM-650 2.3.10 C48/23/50, E24/125 Meets requirements of UL94-V0

 

IsoClad 933 PCB Substrate Copper Clad Laminate Sheet 1

Etiquetas: 

0Laminado revestido con cobre de.1 mm,  

BME217 Laminado revestido de cobre,  

Laminado revestido de cobre de 12 mm

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productos
DETALLES DE LOS PRODUCTOS
Productos

Tablero del PWB del RF

Tablero del PWB de Rogers

Tablero del PWB de PTFE

Alto PWB del Tg

PWB multi de la capa

PWB Taconic

Tablero del PWB de HDI

PWB de alta velocidad

La impedancia controló el PWB

Tablero flexible del PWB

tablero del PWB fr4

plantilla del PWB

PWB de la base del metal

Laminados revestidos de cobre
IsoClad 933 PCB Substrate Copper Clad Laminate Sheet
  • Nombre
IsoClad 933 PCB Substrate Copper Clad Laminate Sheet
Cuota De Producción: 1 Uds.
Precio: USD9.99-99.99
Embalaje Estándar: Bolsas de vacío + cajas de cartón
Período De Entrega: 8-9 días laborables
Método De Pago: T/T
Capacidad De Suministro: 5000 unidades por mes
Información detallada
Descripción del Producto
Información detallada
Lugar de origen
Porcelana
Nombre de la marca
Bicheng
Certificación
UL, ISO9001, IATF16949
Número de modelo
BIC-332.V1.0
Número de pieza:
El ISOClad 933
Espesor del laminado:
0,381 mm 0,787 mm 1,575 mm
Tamaño laminado:
305X460mm(12X18''); 24X18''(610X457mm)
Peso de cobre:
0,5 oz (0,018 mm), 1 oz (0,035 mm);
Cantidad de orden mínima:
1 Uds.
Precio:
USD9.99-99.99
Detalles de empaquetado:
Bolsas de vacío + cajas de cartón
Tiempo de entrega:
8-9 días laborables
Condiciones de pago:
T/T
Capacidad de la fuente:
5000 unidades por mes
Resaltar

IsoClad 933 PCB substrate

,

copper clad laminate sheet

,

PCB substrate with warranty

Descripción del Producto

IsoClad® 933 laminates are nonwoven fiberglass-reinforced PTFE composite materials tailored for deployment as printed circuit board (PCB) substrates. The nonwoven reinforcement architecture imparts enhanced flexural capability, making these laminates ideally suited for applications requiring post-fabrication circuit bending—conformal or “wrap-around” antennas represent a prime use case for this attribute.


Unlike standard nonwoven fiberglass/PTFE alternatives, IsoClad series laminates incorporate longer randomly oriented fibers and leverage a proprietary manufacturing process to deliver superior dimensional stability and enhanced dielectric constant (Dk) uniformity, even when compared to competitive products with equivalent dielectric constant values.


With a dielectric constant (Er) of 2.33, IsoClad 933 laminates utilize a higher fiberglass-to-PTFE ratio to form a highly reinforced composite structure. This optimized formulation achieves improved dimensional stability alongside elevated mechanical strength, without compromising core electrical performance.

 

IsoClad 933 PCB Substrate Copper Clad Laminate Sheet 0


Features

  • Nonwoven fiberglass reinforcement
  • Low dielectric constant (Er = 2.33)
  • Ultra-low signal loss


Benefits

  • Reduced rigidity versus woven fiberglass-reinforced laminates
  • Exceptional isotropy across the X, Y, and Z axes


Typical Applications

  • Conformal antennas
  • Stripline and microstrip circuits
  • Missile guidance systems
  • Radar and electronic warfare systems

 

Property Test Method Condition IsoClad 933
Dielectric Constant @ 10 GHz IPC TM-650 2.5.5.5 C23/50 2.33
Dissipation Factor @ 10 GHz IPC TM-650 2.5.5.5 C23/50 0.0016
Thermal Coefficient of Er (ppm/°C) IPC TM-650 2.5.5.5 (Adapted) -10°C to +140°C -132
Peel Strength (lbs.per inch) IPC TM-650 2.4.8 After Thermal 10
Volume Resistivity (MΩ-cm) IPC TM-650 2.5.17.1 C96/35/90 3.5 x 10⁸
Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 1.0 x 10⁸
Arc Resistance (seconds) ASTM D-495 D48/50 >180
Tensile Modulus (kpsi) ASTM D-638 A, 23°C 173, 147
Tensile Strength (kpsi) ASTM D-882 A, 23°C 6.8, 5.3
Compressive Modulus (kpsi) ASTM D-695 A, 23°C 197
Flexural Modulus (kpsi) ASTM D-790 A, 23°C 239
Dielectric Breakdown (kV) ASTM D-149 D48/50 >45
Density (g/cm³) ASTM D-792 (Method A) A, 23°C 2.27
Water Absorption (%) MIL-S-13949H 3.7.7; IPC TM-650 2.6.2.2 E1/105 + D24/23 0.05
Coefficient of Thermal Expansion (ppm/°C) IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer 0°C to 100°C X Axis: 31
Y Axis: 47 Y Axis: 35    
Z Axis: 236 Z Axis: 203    
Thermal Conductivity (W/mK) ASTM E-1225 100°C 0.263
Outgassing Requirements 125°C, ≤10⁻⁶ torr -  
Total Mass Loss (%) Maximum 1.00% 125°C, ≤10⁻⁶ torr 0.03
Collected Volatile Condensable Material (%) Maximum 0.10% 125°C, ≤10⁻⁶ torr 0.00
Water Vapor Regain (%) - 125°C, ≤10⁻⁶ torr 0.02
Visible Condensate ± 125°C, ≤10⁻⁶ torr NO
Flammability UL 94 Vertical Burn; IPC TM-650 2.3.10 C48/23/50, E24/125 Meets requirements of UL94-V0

 

IsoClad 933 PCB Substrate Copper Clad Laminate Sheet 1

Etiquetas: 

0Laminado revestido con cobre de.1 mm,

BME217 Laminado revestido de cobre,

Laminado revestido de cobre de 12 mm

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan, Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
Mapa del Sitio |  Política de privacidad | China es buena. Calidad Tablero del PWB del RF Proveedor. Derecho de autor 2020-2026 Bicheng Electronics Technology Co., Ltd Todo. Todos los derechos reservados.