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F4BME217 Copper Clad Laminate 0.1mm-12mm Thickness

F4BME217 Copper Clad Laminate 0.1mm-12mm Thickness

Cuota De Producción: 1 Uds.
Precio: USD9.99-99.99
Embalaje Estándar: Bolsas de vacío+cartones
Período De Entrega: 8-9 días hábiles
Método De Pago: T/T
Capacidad De Suministro: 5000 unidades por mes
Información detallada
Lugar de origen
Porcelana
Nombre de la marca
Bicheng
Certificación
UL, ISO9001, IATF16949
Número de modelo
BIC-332.V1.0
Número de pieza:
F4BM217
El espesor del laminado:
0.1mm-12m m
Tamaño laminado:
460X610mm 500X600mm 850X120mm 914X1220mm 1000X1200mm
Peso de cobre:
0,5 onzas (0,018 mm) 1 onzas (0,035 mm)
Resaltar:

0.1mm Copper Clad Laminate

,

BME217 Copper Clad Laminate

,

12mm Copper Clad Laminate

Descripción del Producto

Wangling's F4BME217 is a high-performance PTFE composite laminate engineered for demanding RF and microwave applications. Precision-formulated from woven fiberglass cloth, PTFE resin, and film, it delivers superior, consistent electrical properties.

This next-generation material significantly outperforms its predecessor, F4B220, offering lower dielectric loss, higher insulation resistance, and enhanced stability. It serves as a reliable, high-performance domestic substitute for comparable imported laminates.

F4BME217 Copper Clad Laminate 0.1mm-12mm Thickness 0

 

Key Material Variants:
The core dielectric formulation is available in two copper foil configurations to suit specific application needs:


F4BM217: Clad with standard Electrodeposited (ED) copper foil. This is a cost-effective solution for standard high-frequency applications where low Passive Intermodulation (PIM) is not critical.


F4BME217: Clad with Reverse-Treated Foil (RTF) copper. This configuration provides superior low-PIM performance, enables more precise etching for fine-line circuits, and reduces conductor loss, making it ideal for high-precision designs.

 

Tailored Performance through Material Science:
The electrical and mechanical properties of F4BME217 are precisely tuned by adjusting the ratio of PTFE to fiberglass cloth within the composite. This allows for controlled dielectric constants while maintaining low loss characteristics and enhanced dimensional stability.


A higher dielectric constant is achieved by increasing the fiberglass content, which improves dimensional stability, lowers the thermal expansion coefficient, and reduces temperature drift.


This adjustment involves a balanced trade-off, as a higher fiberglass ratio may result in a marginal increase in dielectric loss.

 

This design flexibility enables engineers to select the optimal material grade for a perfect balance of electrical performance, mechanical robustness, and processing requirements.

 

Typical Application Cases

-Microwave, RF, and Radar

-Phase Shifters, Passive Components

-Power Dividers, Couplers, Combiners

-Feed Networks, Phased Array Antennas

-Satellite Communication, Base Station Antennas

 

Product Technical Parameters Product Model & Data Sheet
Product Features Test Conditions Unit F4BME217
Dielectric Constant (Typical) 10GHz / 2.17
Dielectric Constant Tolerance / / ±0.04
Loss Tangent (Typical) 10GHz / 0.001
20GHz / 0.0014
Dielectric Constant Temperature Coefficient -55ºC~150ºC PPM/℃ -150
Peel Strength 1 OZ F4BM N/mm >1.8
1 OZ F4BME N/mm >1.6
Volume Resistivity Standard Condition MΩ.cm ≥6×10^6
Surface Resistivity Standard Condition ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >23
Breakdown Voltage (XY direction) 5KW,500V/s KV >30
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 25, 34
Z direction -55 º~288ºC ppm/ºC 240
Thermal Stress 260℃, 10s,3 times No delamination
Water Absorption 20±2℃, 24 hours % ≤0.08
Density Room Temperature g/cm3 2.17
Long-Term Operating Temperature High-Low Temperature Chamber -55~+260
Thermal Conductivity Z direction W/(M.K) 0.24
PIM Only applicable to F4BME dBc ≤-159
Flammability / UL-94 V-0
Material Composition PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

 

F4BME217 Copper Clad Laminate 0.1mm-12mm Thickness 1

productos
DETALLES DE LOS PRODUCTOS
F4BME217 Copper Clad Laminate 0.1mm-12mm Thickness
Cuota De Producción: 1 Uds.
Precio: USD9.99-99.99
Embalaje Estándar: Bolsas de vacío+cartones
Período De Entrega: 8-9 días hábiles
Método De Pago: T/T
Capacidad De Suministro: 5000 unidades por mes
Información detallada
Lugar de origen
Porcelana
Nombre de la marca
Bicheng
Certificación
UL, ISO9001, IATF16949
Número de modelo
BIC-332.V1.0
Número de pieza:
F4BM217
El espesor del laminado:
0.1mm-12m m
Tamaño laminado:
460X610mm 500X600mm 850X120mm 914X1220mm 1000X1200mm
Peso de cobre:
0,5 onzas (0,018 mm) 1 onzas (0,035 mm)
Cantidad de orden mínima:
1 Uds.
Precio:
USD9.99-99.99
Detalles de empaquetado:
Bolsas de vacío+cartones
Tiempo de entrega:
8-9 días hábiles
Condiciones de pago:
T/T
Capacidad de la fuente:
5000 unidades por mes
Resaltar

0.1mm Copper Clad Laminate

,

BME217 Copper Clad Laminate

,

12mm Copper Clad Laminate

Descripción del Producto

Wangling's F4BME217 is a high-performance PTFE composite laminate engineered for demanding RF and microwave applications. Precision-formulated from woven fiberglass cloth, PTFE resin, and film, it delivers superior, consistent electrical properties.

This next-generation material significantly outperforms its predecessor, F4B220, offering lower dielectric loss, higher insulation resistance, and enhanced stability. It serves as a reliable, high-performance domestic substitute for comparable imported laminates.

F4BME217 Copper Clad Laminate 0.1mm-12mm Thickness 0

 

Key Material Variants:
The core dielectric formulation is available in two copper foil configurations to suit specific application needs:


F4BM217: Clad with standard Electrodeposited (ED) copper foil. This is a cost-effective solution for standard high-frequency applications where low Passive Intermodulation (PIM) is not critical.


F4BME217: Clad with Reverse-Treated Foil (RTF) copper. This configuration provides superior low-PIM performance, enables more precise etching for fine-line circuits, and reduces conductor loss, making it ideal for high-precision designs.

 

Tailored Performance through Material Science:
The electrical and mechanical properties of F4BME217 are precisely tuned by adjusting the ratio of PTFE to fiberglass cloth within the composite. This allows for controlled dielectric constants while maintaining low loss characteristics and enhanced dimensional stability.


A higher dielectric constant is achieved by increasing the fiberglass content, which improves dimensional stability, lowers the thermal expansion coefficient, and reduces temperature drift.


This adjustment involves a balanced trade-off, as a higher fiberglass ratio may result in a marginal increase in dielectric loss.

 

This design flexibility enables engineers to select the optimal material grade for a perfect balance of electrical performance, mechanical robustness, and processing requirements.

 

Typical Application Cases

-Microwave, RF, and Radar

-Phase Shifters, Passive Components

-Power Dividers, Couplers, Combiners

-Feed Networks, Phased Array Antennas

-Satellite Communication, Base Station Antennas

 

Product Technical Parameters Product Model & Data Sheet
Product Features Test Conditions Unit F4BME217
Dielectric Constant (Typical) 10GHz / 2.17
Dielectric Constant Tolerance / / ±0.04
Loss Tangent (Typical) 10GHz / 0.001
20GHz / 0.0014
Dielectric Constant Temperature Coefficient -55ºC~150ºC PPM/℃ -150
Peel Strength 1 OZ F4BM N/mm >1.8
1 OZ F4BME N/mm >1.6
Volume Resistivity Standard Condition MΩ.cm ≥6×10^6
Surface Resistivity Standard Condition ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >23
Breakdown Voltage (XY direction) 5KW,500V/s KV >30
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 25, 34
Z direction -55 º~288ºC ppm/ºC 240
Thermal Stress 260℃, 10s,3 times No delamination
Water Absorption 20±2℃, 24 hours % ≤0.08
Density Room Temperature g/cm3 2.17
Long-Term Operating Temperature High-Low Temperature Chamber -55~+260
Thermal Conductivity Z direction W/(M.K) 0.24
PIM Only applicable to F4BME dBc ≤-159
Flammability / UL-94 V-0
Material Composition PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil.

 

F4BME217 Copper Clad Laminate 0.1mm-12mm Thickness 1

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