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PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet

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PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet

Cuota De Producción:	1 Uds.
Precio:	USD9.99-99.99
Embalaje Estándar:	Bolsas de vacío + cajas de cartón
Período De Entrega:	8-9 días laborables
Método De Pago:	T/T
Capacidad De Suministro:	5000PCS por mes

Detalles Información

Descripción del Producto

Información detallada

Lugar de origen

Porcelana

Nombre de la marca

Bicheng

Certificación

UL, ISO9001, IATF16949

Número de modelo

BIC-332.V1.0

Número de pieza:

TLY-3

Espesor del laminado:

0,0035 pulgadas; 0,0050 pulgadas; 0,0075 pulgadas; 0,0100 pulgadas

Tamaño laminado:

12 x 18 pulgadas (305 x 457 mm); 16 x 36 pulgadas (406 x 914 mm); 16 x 18 pulgadas (406 x 457 mm); 2

Peso de cobre:

1/2 oz. Cobre ED; 1 oz. Cobre CL1; 1 oz. cobre C1

Resaltar:

PCB material TLY-3 laminate

high frequency copper clad sheet

TLY-3 copper clad laminate

Descripción del Producto

TLY-3 laminates are fabricated using ultra-lightweight woven fiberglass, offering significantly greater dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven fiberglass matrix delivers a mechanically robust laminate ideal for high-volume production. Featuring an extremely low dissipation factor, TLY-3 performs reliably in 77 GHz automotive radar systems and other millimeter-wave antenna designs.

Comparative OEM testing at 77 GHz between low-reinforcement TLY-3 and its nearest chopped fiber-reinforced competitor demonstrated comparable “drop-in” insertion loss and dielectric performance, with the key advantage of drastically improved manufacturing yields. The dielectric constant (Dk) ranges from 2.17 to 2.40. For most thicknesses, Dk can be specified at any value within this range with a tight tolerance of ±0.02. At 10 GHz, the typical dissipation factor (Df) in the low-Dk region is approximately 0.0009.

Typical applications include satellite communications, automotive radar, filters, couplers, avionics, and phased-array antennas.

PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet 0

Properties	Conditions	Typical Value	Unit	Test Method
Electrical Properties	Dielectric Constant @ 10 GHz	2.33 ± 0.02	-	IPC-650 2.5.5.5
	Dissipation Factor @ 10 GHz	0.0012	-	IPC-650 2.5.5.5
	Volume Resistivity (after elevated temp.)	10¹⁰	Mohms/cm	IPC-650 2.5.17.1
	Volume Resistivity (after humidity)	10¹⁰	Mohms/cm	IPC-650 2.5.17.1
	Surface Resistivity (after elevated temp.)	10⁸	Mohms	IPC-650 2.5.17.1
	Surface Resistivity (after humidity)	10⁸	Mohms	IPC-650 2.5.17.1
Thermal Properties	Thermal Conductivity	0.22	W/M*K	ASTM F 433
	CTE (25-260°C) - X	26	ppm/°C	ASTM D 3386 (TMA)
	CTE (25-260°C) - Y	15	ppm/°C	ASTM D 3386 (TMA)
	CTE (25-260°C) - Z	217	ppm/°C	ASTM D 3386 (TMA)
Mechanical Properties	Peel Strength - 1/2 oz. ED copper	1.96 (11)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength - 1 oz. CL1 copper	2.86 (16)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength - 1 oz. C1 copper	3.04 (17)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength (at elevated temp.)	2.32 (13)	N/mm (Ibs/in)	IPC-650 2.4.8
	Flexural Strength - MD	96.91 (14,057)	N/mm² (psi)	IPC-650 2.4.4
	Flexural Strength - CD	89.32 (12,955)	N/mm² (psi)	IPC-650 2.4.4
	Young’s Modulus - MD	9.65 X 10³ (1.4 X 10⁶)	N/mm² (psi)	ASTM D 3039 / IPC-650 2.4.19
	Poisson’s Ratio - MD	0.21	-	ASTM D 3039 / IPC-650 2.4.19
Mechanical Properties	Density Specific Gravity	2.19	g/cm³	ASTM D 792
Mechanical Properties	Dimensional Stability - MD, 10 mil	-0.038	mm/M (mils/in)	IPC-650 2.4.39
Mechanical Properties	Dimensional Stability - CD, 10 mil (avg. after bake & thermal stress)	-0.038	mm/M (mils/in)	-
Chemical / Physical Properties	Moisture Absorption	0.02	%	IPC-650 2.6.2.1
	NASA Outgassing - TML	0.01	%	-
	NASA Outgassing - CVCM	0.01	%	-
	NASA Outgassing - WVR	0.01	%	-
	UL-94 Flammability Rating	V-0	-	UL-94

Key Benefits

Excellent dimensional stability
Ultra-low dissipation factor (Df)
High peel strength
Low moisture absorption
Consistent, uniform dielectric constant (Dk)
Laser-ablatable

Target Applications

Automotive radar
Satellite and cellular communications
Power amplifiers
LNBs, LNAs, and LNCs
Aerospace systems
Ka-band, E-band, and W-band applications

Etiquetas:

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Laminados revestidos de cobre

PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet

Cuota De Producción:	1 Uds.
Precio:	USD9.99-99.99
Embalaje Estándar:	Bolsas de vacío + cajas de cartón
Período De Entrega:	8-9 días laborables
Método De Pago:	T/T
Capacidad De Suministro:	5000PCS por mes

Información detallada

Descripción del Producto

Información detallada

Lugar de origen

Porcelana

Nombre de la marca

Bicheng

Certificación

UL, ISO9001, IATF16949

Número de modelo

BIC-332.V1.0

Número de pieza:

TLY-3

Espesor del laminado:

0,0035 pulgadas; 0,0050 pulgadas; 0,0075 pulgadas; 0,0100 pulgadas

Tamaño laminado:

12 x 18 pulgadas (305 x 457 mm); 16 x 36 pulgadas (406 x 914 mm); 16 x 18 pulgadas (406 x 457 mm); 2

Peso de cobre:

1/2 oz. Cobre ED; 1 oz. Cobre CL1; 1 oz. cobre C1

Cantidad de orden mínima:

1 Uds.

Precio:

USD9.99-99.99

Detalles de empaquetado:

Bolsas de vacío + cajas de cartón

Tiempo de entrega:

8-9 días laborables

Condiciones de pago:

T/T

Capacidad de la fuente:

5000PCS por mes

Resaltar

PCB material TLY-3 laminate

high frequency copper clad sheet

TLY-3 copper clad laminate

Descripción del Producto

Typical applications include satellite communications, automotive radar, filters, couplers, avionics, and phased-array antennas.

PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet 0

Properties	Conditions	Typical Value	Unit	Test Method
Electrical Properties	Dielectric Constant @ 10 GHz	2.33 ± 0.02	-	IPC-650 2.5.5.5
	Dissipation Factor @ 10 GHz	0.0012	-	IPC-650 2.5.5.5
	Volume Resistivity (after elevated temp.)	10¹⁰	Mohms/cm	IPC-650 2.5.17.1
	Volume Resistivity (after humidity)	10¹⁰	Mohms/cm	IPC-650 2.5.17.1
	Surface Resistivity (after elevated temp.)	10⁸	Mohms	IPC-650 2.5.17.1
	Surface Resistivity (after humidity)	10⁸	Mohms	IPC-650 2.5.17.1
Thermal Properties	Thermal Conductivity	0.22	W/M*K	ASTM F 433
	CTE (25-260°C) - X	26	ppm/°C	ASTM D 3386 (TMA)
	CTE (25-260°C) - Y	15	ppm/°C	ASTM D 3386 (TMA)
	CTE (25-260°C) - Z	217	ppm/°C	ASTM D 3386 (TMA)
Mechanical Properties	Peel Strength - 1/2 oz. ED copper	1.96 (11)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength - 1 oz. CL1 copper	2.86 (16)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength - 1 oz. C1 copper	3.04 (17)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength (at elevated temp.)	2.32 (13)	N/mm (Ibs/in)	IPC-650 2.4.8
	Flexural Strength - MD	96.91 (14,057)	N/mm² (psi)	IPC-650 2.4.4
	Flexural Strength - CD	89.32 (12,955)	N/mm² (psi)	IPC-650 2.4.4
	Young’s Modulus - MD	9.65 X 10³ (1.4 X 10⁶)	N/mm² (psi)	ASTM D 3039 / IPC-650 2.4.19
	Poisson’s Ratio - MD	0.21	-	ASTM D 3039 / IPC-650 2.4.19
Mechanical Properties	Density Specific Gravity	2.19	g/cm³	ASTM D 792
Mechanical Properties	Dimensional Stability - MD, 10 mil	-0.038	mm/M (mils/in)	IPC-650 2.4.39
Mechanical Properties	Dimensional Stability - CD, 10 mil (avg. after bake & thermal stress)	-0.038	mm/M (mils/in)	-
Chemical / Physical Properties	Moisture Absorption	0.02	%	IPC-650 2.6.2.1
	NASA Outgassing - TML	0.01	%	-
	NASA Outgassing - CVCM	0.01	%	-
	NASA Outgassing - WVR	0.01	%	-
	UL-94 Flammability Rating	V-0	-	UL-94

Key Benefits

Excellent dimensional stability
Ultra-low dissipation factor (Df)
High peel strength
Low moisture absorption
Consistent, uniform dielectric constant (Dk)
Laser-ablatable

Target Applications

Automotive radar
Satellite and cellular communications
Power amplifiers
LNBs, LNAs, and LNCs
Aerospace systems
Ka-band, E-band, and W-band applications

Etiquetas: