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TLY-5 RF PCB 10mil 2-layer Immersion Gold Finish
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TLY-5 RF PCB 10mil 2-layer Immersion Gold Finish
  • Nombre

TLY-5 RF PCB 10mil 2-layer Immersion Gold Finish

Cuota De Producción: 1 Uds.
Precio: USD9.99-99.99
Embalaje Estándar: Bolsas de vacío+cartones
Período De Entrega: 8-9 días hábiles
Método De Pago: T/T
Capacidad De Suministro: 5000 unidades por mes
Detalles Información
Descripción del Producto
Información detallada
Lugar de origen
Porcelana
Nombre de la marca
Bicheng
Certificación
UL, ISO9001, IATF16949
Número de modelo
BIC-332.V1.0
Materia prima:
El TLY-5
Recuento de capas:
2 capas
Espesor de la PCB:
0,3 mm
Tamaño de PCB:
55 mm × 50 mm
Platina:
NO
Máscara de soldadura:
NO
Peso de cobre:
1 oz (1,4 mils) para capas exteriores
Acabado superficial:
oro de inmersión
Resaltar:

Immersion Gold Finish RF PCB

,

TLY-5 RF PCB

,

2 Layer RF PCB

Descripción del Producto

This 2-layer rigid PCB adopts TLY-5, a dimensionally stable laminate with lightweight woven fiberglass. Specifically engineered to meet rigorous high-frequency RF signal transmission requirements, it is highly applicable to automotive radar and millimeter wave antenna systems.

 

PCB Specifications

Parameter Details
Layer Count 2-Layer (rigid structure)
Base Material TLY-5
Board Dimensions 55mm × 50mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space 6 mils (trace) / 8 mils (space)
Minimum Hole Size 0.2mm
Vias No blind vias; Total vias: 17; Via plating thickness: 20 μm
Finished Board Thickness 0.3mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Immersion Gold
Silkscreen No silkscreen on top layer; No silkscreen on bottom layer
Solder Mask No solder mask on top layer; No solder mask on bottom layer
Quality Assurance 100% electrical test conducted prior to shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm
Substrate Core TLY-5 0.254mm (10 mil)
Bottom Copper Layer (Copper_layer_2) Copper 35 μm

 

TLY-5 Material Introduction

TLY-5 laminates are manufactured with very lightweight woven fiberglass and are much more dimensionally stable than chopped fiber reinforced PTFE composites. The woven matrix in the TLY-5 material yields a more mechanically stable laminate that is suitable for high volume manufacturing. The low dissipation factor enables successful deployment for automotive radar applications designed at 77 GHz as well as other antennas in millimeter wave frequencies.

 

TLY-5 RF PCB 10mil 2-layer Immersion Gold Finish 0

 

Key Material Features

Feature Specification/Description
Material Composition TLY-5 laminate with lightweight woven fiberglass
Dielectric Constant (Dk) 2.2 ± 0.02 at 10 GHz/23°C
Loss Tangent 0.0009 at 10 GHz
Density (Specific Gravity) 2.19 g/cm³
Moisture Absorption 0.02%
Coefficient of Thermal Expansion (CTE) X axis: 26 ppm/°C; Y axis: 15 ppm/°C; Z axis: 217 ppm/°C

 

Core Benefits

Dimensional Stability: Superior to chopped fiber reinforced PTFE composites.

 

Lowest Dissipation Factor (DF): Suitable for 77 GHz automotive radar and millimeter wave applications.

 

Low Moisture Absorption: Minimizes performance degradation in humid environments.

 

High Copper Peel Strength: Enhances structural reliability and component bonding.

 

Uniform & Consistent Dk: Ensures stable electrical performance.

 

High-Volume Manufacturing Suitability: Mechanically stable for mass production.

 

Quality Standard & Availability

Accepted Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification prior to shipment.

 

Availability: Worldwide availability, enabling timely delivery and efficient after-sales support for international customers.

 

Typical Applications

-Automotive Radar

-Satellite/Cellular Communications

-Power Amplifiers

-LNBs, LNAs, LNCs

-Aerospace

-Ka, E and W band Applications

 

Summary

This 2-layer rigid PCB based on TLY-5 substrate is a high-performance solution tailored for high-frequency microwave and RF applications, especially 77 GHz automotive radar. By leveraging TLY-5's superior properties (excellent dimensional stability, lowest dissipation factor, low moisture absorption, uniform Dk), and strict compliance with IPC-Class-2 standards, it effectively meets the rigorous signal transmission requirements of millimeter wave systems.

 

TLY-5 RF PCB 10mil 2-layer Immersion Gold Finish 1

Etiquetas: 

1oz RF PCB Board,  

1.6mm RF PCB Board,  

0.635mm RF PCB Board

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productos
DETALLES DE LOS PRODUCTOS
Productos

Tablero del PWB del RF

Tablero del PWB de Rogers

Tablero del PWB de PTFE

Alto PWB del Tg

PWB multi de la capa

PWB Taconic

Tablero del PWB de HDI

PWB de alta velocidad

La impedancia controló el PWB

Tablero flexible del PWB

tablero del PWB fr4

plantilla del PWB

PWB de la base del metal

Laminados revestidos de cobre
TLY-5 RF PCB 10mil 2-layer Immersion Gold Finish
  • Nombre
TLY-5 RF PCB 10mil 2-layer Immersion Gold Finish
Cuota De Producción: 1 Uds.
Precio: USD9.99-99.99
Embalaje Estándar: Bolsas de vacío+cartones
Período De Entrega: 8-9 días hábiles
Método De Pago: T/T
Capacidad De Suministro: 5000 unidades por mes
Información detallada
Descripción del Producto
Información detallada
Lugar de origen
Porcelana
Nombre de la marca
Bicheng
Certificación
UL, ISO9001, IATF16949
Número de modelo
BIC-332.V1.0
Materia prima:
El TLY-5
Recuento de capas:
2 capas
Espesor de la PCB:
0,3 mm
Tamaño de PCB:
55 mm × 50 mm
Platina:
NO
Máscara de soldadura:
NO
Peso de cobre:
1 oz (1,4 mils) para capas exteriores
Acabado superficial:
oro de inmersión
Cantidad de orden mínima:
1 Uds.
Precio:
USD9.99-99.99
Detalles de empaquetado:
Bolsas de vacío+cartones
Tiempo de entrega:
8-9 días hábiles
Condiciones de pago:
T/T
Capacidad de la fuente:
5000 unidades por mes
Resaltar

Immersion Gold Finish RF PCB

,

TLY-5 RF PCB

,

2 Layer RF PCB

Descripción del Producto

This 2-layer rigid PCB adopts TLY-5, a dimensionally stable laminate with lightweight woven fiberglass. Specifically engineered to meet rigorous high-frequency RF signal transmission requirements, it is highly applicable to automotive radar and millimeter wave antenna systems.

 

PCB Specifications

Parameter Details
Layer Count 2-Layer (rigid structure)
Base Material TLY-5
Board Dimensions 55mm × 50mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space 6 mils (trace) / 8 mils (space)
Minimum Hole Size 0.2mm
Vias No blind vias; Total vias: 17; Via plating thickness: 20 μm
Finished Board Thickness 0.3mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Immersion Gold
Silkscreen No silkscreen on top layer; No silkscreen on bottom layer
Solder Mask No solder mask on top layer; No solder mask on bottom layer
Quality Assurance 100% electrical test conducted prior to shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm
Substrate Core TLY-5 0.254mm (10 mil)
Bottom Copper Layer (Copper_layer_2) Copper 35 μm

 

TLY-5 Material Introduction

TLY-5 laminates are manufactured with very lightweight woven fiberglass and are much more dimensionally stable than chopped fiber reinforced PTFE composites. The woven matrix in the TLY-5 material yields a more mechanically stable laminate that is suitable for high volume manufacturing. The low dissipation factor enables successful deployment for automotive radar applications designed at 77 GHz as well as other antennas in millimeter wave frequencies.

 

TLY-5 RF PCB 10mil 2-layer Immersion Gold Finish 0

 

Key Material Features

Feature Specification/Description
Material Composition TLY-5 laminate with lightweight woven fiberglass
Dielectric Constant (Dk) 2.2 ± 0.02 at 10 GHz/23°C
Loss Tangent 0.0009 at 10 GHz
Density (Specific Gravity) 2.19 g/cm³
Moisture Absorption 0.02%
Coefficient of Thermal Expansion (CTE) X axis: 26 ppm/°C; Y axis: 15 ppm/°C; Z axis: 217 ppm/°C

 

Core Benefits

Dimensional Stability: Superior to chopped fiber reinforced PTFE composites.

 

Lowest Dissipation Factor (DF): Suitable for 77 GHz automotive radar and millimeter wave applications.

 

Low Moisture Absorption: Minimizes performance degradation in humid environments.

 

High Copper Peel Strength: Enhances structural reliability and component bonding.

 

Uniform & Consistent Dk: Ensures stable electrical performance.

 

High-Volume Manufacturing Suitability: Mechanically stable for mass production.

 

Quality Standard & Availability

Accepted Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification prior to shipment.

 

Availability: Worldwide availability, enabling timely delivery and efficient after-sales support for international customers.

 

Typical Applications

-Automotive Radar

-Satellite/Cellular Communications

-Power Amplifiers

-LNBs, LNAs, LNCs

-Aerospace

-Ka, E and W band Applications

 

Summary

This 2-layer rigid PCB based on TLY-5 substrate is a high-performance solution tailored for high-frequency microwave and RF applications, especially 77 GHz automotive radar. By leveraging TLY-5's superior properties (excellent dimensional stability, lowest dissipation factor, low moisture absorption, uniform Dk), and strict compliance with IPC-Class-2 standards, it effectively meets the rigorous signal transmission requirements of millimeter wave systems.

 

TLY-5 RF PCB 10mil 2-layer Immersion Gold Finish 1

Etiquetas: 

1oz RF PCB Board,

1.6mm RF PCB Board,

0.635mm RF PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan, Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
Mapa del Sitio |  Política de privacidad | China es buena. Calidad Tablero del PWB del RF Proveedor. Derecho de autor 2020-2025 Bicheng Electronics Technology Co., Ltd Todo. Todos los derechos reservados.