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Copper Coin Embedded PCB 6-Layer M6+High TG FR4

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Copper Coin Embedded PCB 6-Layer M6+High TG FR4

Cuota De Producción:	1 por ciento
Precio:	USD9.99-99.99
Embalaje Estándar:	Bolsas de vacío+cartones
Período De Entrega:	8-9 días hábiles
Método De Pago:	T/T
Capacidad De Suministro:	5000pcs por mes

Detalles Información

Descripción del Producto

Información detallada

Lugar de origen

PORCELANA

Nombre de la marca

Bicheng

Certificación

UL, ISO9001, IATF16949

Número de modelo

BIC-052.V1.0

Material base:

M6 Material de alta velocidad + FR-4 de alta Tg

Recuento de capas:

6 capas

Espesor de la PCB:

1.0 mm

Tamaño de PCB:

100 mm × 50 mm por unidad (tolerancia: ±0,15 mm)

Peso de cobre:

Capas exteriores: 1 oz (1,4 mils, ~35 μm) - Capas interiores: mezcladas de 1 oz (~35 μm) y 0,5 oz (~

Acabado superficial:

Gold de inmersión de níquel electroales (Enig)

Resaltar:

Copper Coin PCB 6-layer

High TG FR4 RF PCB

Embedded Copper Coin PCB

Descripción del Producto

Copper coin embedded PCB 6-Layer M6+High TG FR4

This 6-layer PCB integrates high-performance M6 High Speed material with High Tg FR-4, designed for demanding high-frequency, high-temperature, and reliability-critical applications. It complies with global quality standards and supports complex circuit designs across industries like 5G, automotive, and aerospace.

1. PCB details

Parameter	Specification
Base Material	M6 High Speed material + High Tg FR-4 (optimized for high-frequency performance)
Layer Count	6 Layers (rigid structure)
Board Dimensions	100mm × 50mm per unit (tolerance: ±0.15mm)
Trace/Space (Minimum)	4 mils (trace) / 5 mils (space)
Hole Size (Minimum)	0.3mm (no blind vias)
Finished Board Thickness	1.0mm
Copper Weight	- Outer Layers: 1oz (1.4 mils, ~35μm)- Inner Layers: Mixed 1oz (~35μm) & 0.5oz (~18μm)
Via Plating Thickness	20μm
Surface Finish	Electroless Nickel Immersion Gold (ENIG) – ensures excellent solderability, corrosion resistance, and long-term reliability
Silkscreen	Top/Bottom Layers: White (high contrast for component identification)
Solder Mask	Top/Bottom Layers: Green (protects copper traces, prevents solder bridging)
Special Features	- Copper coin embedded in the PCB center (enhances thermal conductivity)- All vias: Resin-filled and capped (prevents solder wicking, improves surface flatness for SMT assembly)
Quality Testing	100% Electrical Test (open/short circuit detection) prior to shipment

2. PCB Stack-up

Layer Type	Material Specification	Thickness
Top Copper Layer	Electrolytic Copper	35 μm
Core Layer	M6 High Speed Material (R5775G)	0.25 mm
Inner Copper Layer 1 (Inn1)	Electrolytic Copper	18 μm
Prepreg Layer	1080 Style Prepreg (64% resin content), 2 sheets stacked	0.14 mm
Inner Copper Layer 2 (Inn2)	Electrolytic Copper	35 μm
Core Layer	High Tg FR-4 (IT-180)	0.1 mm
Inner Copper Layer 3 (Inn3)	Electrolytic Copper	35 μm
Prepreg Layer	1080 Style Prepreg (64% resin content), 2 sheets stacked	0.14 mm
Inner Copper Layer 4 (Inn4)	Electrolytic Copper	18 μm
Core Layer	High Tg FR-4 (IT-180)	0.1 mm
Bottom Copper Layer	Electrolytic Copper	35 μm

Copper Coin Embedded PCB 6-Layer M6+High TG FR4 0

3. Material Advantages: M6 High Speed Material

The M6 material is the cornerstone of this PCB’s high-performance capabilities, offering exceptional electrical, thermal, and mechanical properties:

Electrical Performance:

Dielectric Constant (DK): 3.4 at 1GHz/23°C, 3.34 at 13GHz (low and stable across high frequencies, minimizing signal loss).

Dissipation Factor (Df): 0.002 at 1GHz/23°C, 0.0037 at 13GHz (ultra-low signal attenuation, critical for 5G/mmWave applications).

Thermal Stability:

High Glass Transition Temperature (Tg): >185°C (DSC method), 210°C (DMA method) – resists deformation under high operating temperatures.

Thermal Decomposition Temperature (Td): 410°C (TGA method) – ensures durability in extreme heat environments.

Mechanical Reliability:

Coefficient of Thermal Expansion (CTE): X/Y axis = 16 ppm/°C, Z axis = 45 ppm/°C (low thermal expansion, reduces stress from temperature cycles).

Flammability: UL 94V-0 (self-extinguishing, meets safety standards for electronics).

Manufacturability & Sustainability:

Compatible with traditional FR-4 processing (no special equipment required, lowering production costs). RoHS and halogen-free compliant (aligns with global green manufacturing standards).

Design Flexibility: Supports 4–30 layer multilayer PCBs, adapting to complex circuit architectures.

4. Quality & Availability

Quality Standard: IPC-Class-2 (meets industry requirements for general electronics, with consistent performance and reliability).

Artwork Format: Gerber RS-274-X (industry-standard format for PCB fabrication, compatible with all major manufacturing systems).

Availability: Worldwide (supports global projects for large-scale production).

5. Typical Applications

This PCB is optimized for high-frequency, high-reliability scenarios, including:

5G Communication Base Stations: Millimeter-wave antennas, radio-frequency (RF) front-ends of Active Antenna Units (AAU) (leveraging M6’s low DK/DF for minimal signal loss).

Automotive Electronics: 77GHz millimeter-wave radar, Advanced Driver-Assistance Systems (ADAS) (high Tg and Td ensure durability in automotive temperature extremes).

Networking & Communications: High-speed routers, switches, and optical transceivers (supports complex multilayer designs for data-intensive circuits).

Aerospace & Defense: Radar systems, avionics, and military communication devices (meets strict reliability and environmental standards).

Copper Coin Embedded PCB 6-Layer M6+High TG FR4 1

Etiquetas:

1oz RF PCB Board,

1.6mm RF PCB Board,

0.635mm RF PCB Board

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Copper Coin Embedded PCB 6-Layer M6+High TG FR4

Cuota De Producción:	1 por ciento
Precio:	USD9.99-99.99
Embalaje Estándar:	Bolsas de vacío+cartones
Período De Entrega:	8-9 días hábiles
Método De Pago:	T/T
Capacidad De Suministro:	5000pcs por mes

Información detallada

Descripción del Producto

Información detallada

Lugar de origen

PORCELANA

Nombre de la marca

Bicheng

Certificación

UL, ISO9001, IATF16949

Número de modelo

BIC-052.V1.0

Material base:

M6 Material de alta velocidad + FR-4 de alta Tg

Recuento de capas:

6 capas

Espesor de la PCB:

1.0 mm

Tamaño de PCB:

100 mm × 50 mm por unidad (tolerancia: ±0,15 mm)

Peso de cobre:

Capas exteriores: 1 oz (1,4 mils, ~35 μm) - Capas interiores: mezcladas de 1 oz (~35 μm) y 0,5 oz (~

Acabado superficial:

Gold de inmersión de níquel electroales (Enig)

Cantidad de orden mínima:

1 por ciento

Precio:

USD9.99-99.99

Detalles de empaquetado:

Bolsas de vacío+cartones

Tiempo de entrega:

8-9 días hábiles

Condiciones de pago:

T/T

Capacidad de la fuente:

5000pcs por mes

Resaltar

Copper Coin PCB 6-layer

High TG FR4 RF PCB

Embedded Copper Coin PCB

Descripción del Producto

Copper coin embedded PCB 6-Layer M6+High TG FR4

1. PCB details

Parameter	Specification
Base Material	M6 High Speed material + High Tg FR-4 (optimized for high-frequency performance)
Layer Count	6 Layers (rigid structure)
Board Dimensions	100mm × 50mm per unit (tolerance: ±0.15mm)
Trace/Space (Minimum)	4 mils (trace) / 5 mils (space)
Hole Size (Minimum)	0.3mm (no blind vias)
Finished Board Thickness	1.0mm
Copper Weight	- Outer Layers: 1oz (1.4 mils, ~35μm)- Inner Layers: Mixed 1oz (~35μm) & 0.5oz (~18μm)
Via Plating Thickness	20μm
Surface Finish	Electroless Nickel Immersion Gold (ENIG) – ensures excellent solderability, corrosion resistance, and long-term reliability
Silkscreen	Top/Bottom Layers: White (high contrast for component identification)
Solder Mask	Top/Bottom Layers: Green (protects copper traces, prevents solder bridging)
Special Features	- Copper coin embedded in the PCB center (enhances thermal conductivity)- All vias: Resin-filled and capped (prevents solder wicking, improves surface flatness for SMT assembly)
Quality Testing	100% Electrical Test (open/short circuit detection) prior to shipment

2. PCB Stack-up

Layer Type	Material Specification	Thickness
Top Copper Layer	Electrolytic Copper	35 μm
Core Layer	M6 High Speed Material (R5775G)	0.25 mm
Inner Copper Layer 1 (Inn1)	Electrolytic Copper	18 μm
Prepreg Layer	1080 Style Prepreg (64% resin content), 2 sheets stacked	0.14 mm
Inner Copper Layer 2 (Inn2)	Electrolytic Copper	35 μm
Core Layer	High Tg FR-4 (IT-180)	0.1 mm
Inner Copper Layer 3 (Inn3)	Electrolytic Copper	35 μm
Prepreg Layer	1080 Style Prepreg (64% resin content), 2 sheets stacked	0.14 mm
Inner Copper Layer 4 (Inn4)	Electrolytic Copper	18 μm
Core Layer	High Tg FR-4 (IT-180)	0.1 mm
Bottom Copper Layer	Electrolytic Copper	35 μm

Copper Coin Embedded PCB 6-Layer M6+High TG FR4 0

3. Material Advantages: M6 High Speed Material

The M6 material is the cornerstone of this PCB’s high-performance capabilities, offering exceptional electrical, thermal, and mechanical properties:

Electrical Performance:

Dielectric Constant (DK): 3.4 at 1GHz/23°C, 3.34 at 13GHz (low and stable across high frequencies, minimizing signal loss).

Dissipation Factor (Df): 0.002 at 1GHz/23°C, 0.0037 at 13GHz (ultra-low signal attenuation, critical for 5G/mmWave applications).

Thermal Stability:

High Glass Transition Temperature (Tg): >185°C (DSC method), 210°C (DMA method) – resists deformation under high operating temperatures.

Thermal Decomposition Temperature (Td): 410°C (TGA method) – ensures durability in extreme heat environments.

Mechanical Reliability:

Coefficient of Thermal Expansion (CTE): X/Y axis = 16 ppm/°C, Z axis = 45 ppm/°C (low thermal expansion, reduces stress from temperature cycles).

Flammability: UL 94V-0 (self-extinguishing, meets safety standards for electronics).

Manufacturability & Sustainability:

Compatible with traditional FR-4 processing (no special equipment required, lowering production costs). RoHS and halogen-free compliant (aligns with global green manufacturing standards).

Design Flexibility: Supports 4–30 layer multilayer PCBs, adapting to complex circuit architectures.

4. Quality & Availability

Quality Standard: IPC-Class-2 (meets industry requirements for general electronics, with consistent performance and reliability).

Artwork Format: Gerber RS-274-X (industry-standard format for PCB fabrication, compatible with all major manufacturing systems).

Availability: Worldwide (supports global projects for large-scale production).

5. Typical Applications

This PCB is optimized for high-frequency, high-reliability scenarios, including:

5G Communication Base Stations: Millimeter-wave antennas, radio-frequency (RF) front-ends of Active Antenna Units (AAU) (leveraging M6’s low DK/DF for minimal signal loss).

Automotive Electronics: 77GHz millimeter-wave radar, Advanced Driver-Assistance Systems (ADAS) (high Tg and Td ensure durability in automotive temperature extremes).

Networking & Communications: High-speed routers, switches, and optical transceivers (supports complex multilayer designs for data-intensive circuits).

Aerospace & Defense: Radar systems, avionics, and military communication devices (meets strict reliability and environmental standards).

Copper Coin Embedded PCB 6-Layer M6+High TG FR4 1

Etiquetas: