| Cuota De Producción: | 1 por ciento |
| Precio: | USD9.99-99.99 |
| Embalaje Estándar: | Bolsas de vacío+cartones |
| Período De Entrega: | 8-9 días hábiles |
| Método De Pago: | T/T |
| Capacidad De Suministro: | 5000pcs por mes |
| Parameter | Technical Details |
|---|---|
| Base Material | IsoClad 933 (high-performance dielectric material) |
| Layer Count | 2-layer rigid configuration |
| Board Dimensions | 155.4mm × 188mm ±0.15mm |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.3mm |
| Vias | No blind vias; via plating thickness 20 μm |
| Finished Board Thickness | 1.6mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Black |
| Bottom Solder Mask | No |
| Quality Assurance | 100% electrical testing (continuity, isolation) |
| Cuota De Producción: | 1 por ciento |
| Precio: | USD9.99-99.99 |
| Embalaje Estándar: | Bolsas de vacío+cartones |
| Período De Entrega: | 8-9 días hábiles |
| Método De Pago: | T/T |
| Capacidad De Suministro: | 5000pcs por mes |
| Parameter | Technical Details |
|---|---|
| Base Material | IsoClad 933 (high-performance dielectric material) |
| Layer Count | 2-layer rigid configuration |
| Board Dimensions | 155.4mm × 188mm ±0.15mm |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.3mm |
| Vias | No blind vias; via plating thickness 20 μm |
| Finished Board Thickness | 1.6mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Black |
| Bottom Solder Mask | No |
| Quality Assurance | 100% electrical testing (continuity, isolation) |