| Cuota De Producción: | 1 por ciento |
| Precio: | USD9.99-99.99 |
| Embalaje Estándar: | Bolsas de vacío+cartones |
| Período De Entrega: | 8-9 días hábiles |
| Método De Pago: | T/T |
| Capacidad De Suministro: | 5000pcs por mes |
| Parameter | Specification |
|---|---|
| Layer Count | 2 layers |
| Board Dimensions | 53mm x 36mm (±0.15mm), 1 piece |
| Minimum Trace/Space | 4/4 mils, letting dense, complex circuits fit in small spaces without hurting signal quality |
| Minimum Hole Size | 0.3mm, fitting small parts like tiny connectors and precision resistors |
| Blind Vias | None, simplifying manufacturing and cutting costs while keeping connections reliable |
| Finished Thickness | 1.6mm, balancing sturdiness and practicality for space-limited uses |
| Outer Cu Weight | 1oz (1.4 mils), ensuring good conductivity for moderate currents |
| Via Plating | 20μm thick, boosting interlayer connection durability against thermal and mechanical stress |
| Surface Finish | ENIG (Electroless Nickel and Immersion Gold), offering great corrosion resistance and solderability for consistent joints and long life |
| Silkscreen | Black on top (easy part ID), none on bottom (simpler layout, lower cost) |
| Solder Mask | None on top or bottom, possibly for specific design needs |
| Electrical Test | 100% checked before shipping (short circuits, open circuits, impedance) to guarantee function |
| Layer | Material/Component | Thickness |
|---|---|---|
| Copper_layer_1 | Copper | 35 μm |
| Core | Rogers Kappa 438 | 1.524 mm (60mil) |
| Copper_layer_2 | Copper | 35 μm |
| Cuota De Producción: | 1 por ciento |
| Precio: | USD9.99-99.99 |
| Embalaje Estándar: | Bolsas de vacío+cartones |
| Período De Entrega: | 8-9 días hábiles |
| Método De Pago: | T/T |
| Capacidad De Suministro: | 5000pcs por mes |
| Parameter | Specification |
|---|---|
| Layer Count | 2 layers |
| Board Dimensions | 53mm x 36mm (±0.15mm), 1 piece |
| Minimum Trace/Space | 4/4 mils, letting dense, complex circuits fit in small spaces without hurting signal quality |
| Minimum Hole Size | 0.3mm, fitting small parts like tiny connectors and precision resistors |
| Blind Vias | None, simplifying manufacturing and cutting costs while keeping connections reliable |
| Finished Thickness | 1.6mm, balancing sturdiness and practicality for space-limited uses |
| Outer Cu Weight | 1oz (1.4 mils), ensuring good conductivity for moderate currents |
| Via Plating | 20μm thick, boosting interlayer connection durability against thermal and mechanical stress |
| Surface Finish | ENIG (Electroless Nickel and Immersion Gold), offering great corrosion resistance and solderability for consistent joints and long life |
| Silkscreen | Black on top (easy part ID), none on bottom (simpler layout, lower cost) |
| Solder Mask | None on top or bottom, possibly for specific design needs |
| Electrical Test | 100% checked before shipping (short circuits, open circuits, impedance) to guarantee function |
| Layer | Material/Component | Thickness |
|---|---|---|
| Copper_layer_1 | Copper | 35 μm |
| Core | Rogers Kappa 438 | 1.524 mm (60mil) |
| Copper_layer_2 | Copper | 35 μm |