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Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish
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Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish
  • Nombre

Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish

Cuota De Producción: 1 Uds.
Precio: USD9.99-99.99
Embalaje Estándar: Bolsas de vacío+cartones
Período De Entrega: 8-9 días hábiles
Método De Pago: T/T
Capacidad De Suministro: 5000pcs por mes
Detalles Información
Descripción del Producto
Información detallada
Lugar de origen
Porcelana
Nombre de la marca
Bicheng
Certificación
UL, ISO9001, IATF16949
Número de modelo
BIC-332.V1.0
Material base:
Rogers TC600
Recuento de capas:
2 capas
Espesor de la PCB:
0.8 mm
Tamaño de PCB:
112 mm x 60 mm (1 pieza) ±0,15 mm
Platina:
Blanco
Máscara de soldadura:
Verde
Peso de cobre:
1 oz (1,4 mils) para capas exteriores
Acabado superficial:
Niquel sin electrolicio Palladio sin electrolicio y oro de inmersión (ENEPIG)
Resaltar:

Rogers TC600 PCB board

,

Double-sided ENEPIG PCB

,

0.8mm Rogers PCB

Descripción del Producto
Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish
This 2-layer RF PCB is constructed with Rogers TC600--a specialized composite of PTFE, thermally conductive ceramic fillers, and woven glass reinforcement. Engineered to deliver exceptional thermal conductivity (for heat management) and low dielectric loss (for signal integrity), it meets IPC-Class-2 standards and is ideal for power-dense, space-constrained applications like amplifiers, antennas, and avionics components.
PCB Specification
Parameter Details
Base Material Rogers TC600 (PTFE + thermally conductive ceramic fillers + woven glass reinforcement)
Layer Count Double sided (2-layer rigid PCB)
Board Dimensions 112mm x 60mm (1 piece)±0.15mm
Minimum Trace/Space 5/5 mils
Minimum Hole Size 0.3mm
Via Type No blind vias (thru-hole vias only)
Finished Board Thickness 0.8mm
Finished Copper Weight (Outer Layers) 1oz (1.4 mils total: 18μm base copper + 17μm plating per layer)
Via Plating Thickness 20 μm
Surface Finish Electroless Nickel Electroless Palladium and Immersion Gold (ENEPIG)
Silkscreen Top: White; Bottom: No
Solder Mask Top: Green; Bottom: No
Quality Assurance 100% Electrical test prior to shipment
PCB Stack-up Details
Layer Type Material/Description Thickness
Copper Layer (Top) 18μm base copper + 17μm plating (finished: 1oz / 35μm total) 35 μm (1oz)
Dielectric Layer Rogers TC600 0.762 mm (30 mils)
Copper Layer (Bottom) 18μm base copper + 17μm plating (finished: 1oz / 35μm total) 35 μm (1oz)
Material Overview: Rogers TC600 Laminates
Rogers TC600 is a advanced composite laminate designed to address two critical challenges in high-frequency and power-dense circuits: thermal management and signal loss. By combining PTFE (for low dielectric loss) with thermally conductive ceramic fillers (for heat transfer) and woven glass reinforcement (for mechanical robustness), TC600 delivers "best-in-class" thermal conductivity while minimizing dielectric and insertion loss. This unique formulation enables PCB size reduction (via higher efficiency), improves power handling, reduces hotspots, and enhances long-term device reliability--making it a top choice for avionics, antennas, and power amplifiers.
Key Material Features
Specification Value
Material Type PTFE + thermally conductive ceramic fillers + woven glass reinforcement
Dielectric Constant (Dk) 6.15 at 1.8 MHz and 10 GHz / 23°C
Dissipation Factor (tanδ) 0.0017 at 1.8 GHz; 0.0020 at 10 GHz / 23°C
Thermal Conductivity 1.1 W/mK
Temperature Coefficient of Dielectric Constant (TCDk) -75 ppm/°C (range: -40°C to 140°C)
Coefficient of Thermal Expansion (CTE) X-axis: 9 ppm/°C; Y-axis: 9 ppm/°C; Z-axis: 35 ppm/°C
Moisture Absorption 0.03%
Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish 0
Core Benefits
Enables Compact Design: Higher efficiency (from low loss) and thermal performance allow for smaller PCB footprints compared to lower-Dk substrates, ideal for space-constrained systems.
Superior Thermal Management: Best-in-class thermal conductivity (1.1 W/mK) reduces heat buildup, minimizes hotspots, and boosts power handling--extending component lifespan.
Low Signal Loss: Ultra-low dielectric loss (0.0017-0.0020) preserves signal integrity, leading to higher amplifier/antenna gains and efficiencies.
Stable Performance Across Temperatures: Consistent Dk (TCDk: -75 ppm/°C) and low CTE ensure reliability in extreme temperature ranges (-40°C to 140°C).
Reliable Component Integration: CTE closely matches active components, reducing stress on solder joints and improving long-term assembly reliability.
Easy Processing: Mechanical robustness (from woven glass reinforcement) simplifies manufacturing while maintaining dimensional stability.
Typical Applications
This PCB is optimized for high-power, high-frequency systems requiring thermal efficiency and signal integrity, including:
  • Power Amplifiers, Filters, and Couplers
  • Microwave Combiner and Power Divider Boards (Avionics Applications)
  • Small Footprint Antennas
  • Digital Audio Broadcasting (DAB) Antennas (Satellite Radio)
  • GPS & Hand-held RFID Reader Antennas
Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish 1
Etiquetas: 

RO4003C LoPro Rogers PCB Board,  

8mil Rogers PCB Board,  

0.5oz Rogers PCB Board

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productos
DETALLES DE LOS PRODUCTOS
Productos

Tablero del PWB del RF

Tablero del PWB de Rogers

Tablero del PWB de PTFE

Alto PWB del Tg

PWB multi de la capa

PWB Taconic

Tablero del PWB de HDI

PWB de alta velocidad

La impedancia controló el PWB

Tablero flexible del PWB

tablero del PWB fr4

plantilla del PWB

PWB de la base del metal
Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish
  • Nombre
Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish
Cuota De Producción: 1 Uds.
Precio: USD9.99-99.99
Embalaje Estándar: Bolsas de vacío+cartones
Período De Entrega: 8-9 días hábiles
Método De Pago: T/T
Capacidad De Suministro: 5000pcs por mes
Información detallada
Descripción del Producto
Información detallada
Lugar de origen
Porcelana
Nombre de la marca
Bicheng
Certificación
UL, ISO9001, IATF16949
Número de modelo
BIC-332.V1.0
Material base:
Rogers TC600
Recuento de capas:
2 capas
Espesor de la PCB:
0.8 mm
Tamaño de PCB:
112 mm x 60 mm (1 pieza) ±0,15 mm
Platina:
Blanco
Máscara de soldadura:
Verde
Peso de cobre:
1 oz (1,4 mils) para capas exteriores
Acabado superficial:
Niquel sin electrolicio Palladio sin electrolicio y oro de inmersión (ENEPIG)
Cantidad de orden mínima:
1 Uds.
Precio:
USD9.99-99.99
Detalles de empaquetado:
Bolsas de vacío+cartones
Tiempo de entrega:
8-9 días hábiles
Condiciones de pago:
T/T
Capacidad de la fuente:
5000pcs por mes
Resaltar

Rogers TC600 PCB board

,

Double-sided ENEPIG PCB

,

0.8mm Rogers PCB

Descripción del Producto
Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish
This 2-layer RF PCB is constructed with Rogers TC600--a specialized composite of PTFE, thermally conductive ceramic fillers, and woven glass reinforcement. Engineered to deliver exceptional thermal conductivity (for heat management) and low dielectric loss (for signal integrity), it meets IPC-Class-2 standards and is ideal for power-dense, space-constrained applications like amplifiers, antennas, and avionics components.
PCB Specification
Parameter Details
Base Material Rogers TC600 (PTFE + thermally conductive ceramic fillers + woven glass reinforcement)
Layer Count Double sided (2-layer rigid PCB)
Board Dimensions 112mm x 60mm (1 piece)±0.15mm
Minimum Trace/Space 5/5 mils
Minimum Hole Size 0.3mm
Via Type No blind vias (thru-hole vias only)
Finished Board Thickness 0.8mm
Finished Copper Weight (Outer Layers) 1oz (1.4 mils total: 18μm base copper + 17μm plating per layer)
Via Plating Thickness 20 μm
Surface Finish Electroless Nickel Electroless Palladium and Immersion Gold (ENEPIG)
Silkscreen Top: White; Bottom: No
Solder Mask Top: Green; Bottom: No
Quality Assurance 100% Electrical test prior to shipment
PCB Stack-up Details
Layer Type Material/Description Thickness
Copper Layer (Top) 18μm base copper + 17μm plating (finished: 1oz / 35μm total) 35 μm (1oz)
Dielectric Layer Rogers TC600 0.762 mm (30 mils)
Copper Layer (Bottom) 18μm base copper + 17μm plating (finished: 1oz / 35μm total) 35 μm (1oz)
Material Overview: Rogers TC600 Laminates
Rogers TC600 is a advanced composite laminate designed to address two critical challenges in high-frequency and power-dense circuits: thermal management and signal loss. By combining PTFE (for low dielectric loss) with thermally conductive ceramic fillers (for heat transfer) and woven glass reinforcement (for mechanical robustness), TC600 delivers "best-in-class" thermal conductivity while minimizing dielectric and insertion loss. This unique formulation enables PCB size reduction (via higher efficiency), improves power handling, reduces hotspots, and enhances long-term device reliability--making it a top choice for avionics, antennas, and power amplifiers.
Key Material Features
Specification Value
Material Type PTFE + thermally conductive ceramic fillers + woven glass reinforcement
Dielectric Constant (Dk) 6.15 at 1.8 MHz and 10 GHz / 23°C
Dissipation Factor (tanδ) 0.0017 at 1.8 GHz; 0.0020 at 10 GHz / 23°C
Thermal Conductivity 1.1 W/mK
Temperature Coefficient of Dielectric Constant (TCDk) -75 ppm/°C (range: -40°C to 140°C)
Coefficient of Thermal Expansion (CTE) X-axis: 9 ppm/°C; Y-axis: 9 ppm/°C; Z-axis: 35 ppm/°C
Moisture Absorption 0.03%
Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish 0
Core Benefits
Enables Compact Design: Higher efficiency (from low loss) and thermal performance allow for smaller PCB footprints compared to lower-Dk substrates, ideal for space-constrained systems.
Superior Thermal Management: Best-in-class thermal conductivity (1.1 W/mK) reduces heat buildup, minimizes hotspots, and boosts power handling--extending component lifespan.
Low Signal Loss: Ultra-low dielectric loss (0.0017-0.0020) preserves signal integrity, leading to higher amplifier/antenna gains and efficiencies.
Stable Performance Across Temperatures: Consistent Dk (TCDk: -75 ppm/°C) and low CTE ensure reliability in extreme temperature ranges (-40°C to 140°C).
Reliable Component Integration: CTE closely matches active components, reducing stress on solder joints and improving long-term assembly reliability.
Easy Processing: Mechanical robustness (from woven glass reinforcement) simplifies manufacturing while maintaining dimensional stability.
Typical Applications
This PCB is optimized for high-power, high-frequency systems requiring thermal efficiency and signal integrity, including:
  • Power Amplifiers, Filters, and Couplers
  • Microwave Combiner and Power Divider Boards (Avionics Applications)
  • Small Footprint Antennas
  • Digital Audio Broadcasting (DAB) Antennas (Satellite Radio)
  • GPS & Hand-held RFID Reader Antennas
Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish 1
Etiquetas: 

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan, Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
Mapa del Sitio |  Política de privacidad | China es buena. Calidad Tablero del PWB del RF Proveedor. Derecho de autor 2020-2025 Bicheng Electronics Technology Co., Ltd Todo. Todos los derechos reservados.