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Rogers PCB RO3203 Double-Layer 10mil ENEPIG Finish
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Rogers PCB RO3203 Double-Layer 10mil ENEPIG Finish
  • Nombre

Rogers PCB RO3203 Double-Layer 10mil ENEPIG Finish

Cuota De Producción: 1 Uds.
Precio: USD9.99-99.99
Embalaje Estándar: Bolsas de vacío+cartones
Período De Entrega: 8-9 días hábiles
Método De Pago: T/T
Capacidad De Suministro: 5000pcs por mes
Detalles Información
Descripción del Producto
Información detallada
Lugar de origen
Porcelana
Nombre de la marca
Bicheng
Certificación
UL, ISO9001, IATF16949
Número de modelo
BIC-332.V1.0
Material base:
ROGERS RO3203
Recuento de capas:
2 capas
Espesor de la PCB:
0.35 mm
Tamaño de PCB:
74,57 mm x 23,28 mm por pieza (1 unidad),
Platina:
Blanco
Máscara de soldadura:
Verde
Peso de cobre:
1 oz (1,4 mils) para capas exteriores
Acabado superficial:
ENEPIG
Resaltar:

Rogers RO3203 double-layer PCB

,

10mil ENEPIG finish PCB

,

Rogers PCB with ENEPIG coating

Descripción del Producto
Rogers PCB RO3203 Double-Layer 10mil ENEPIG Finish
This 2-layer rigid PCB is tailored for high-frequency applications (exceeding 40 GHz), leveraging Rogers RO3203—a ceramic-filled, woven fiberglass-reinforced laminate—to deliver exceptional signal integrity, mechanical stability, and cost-effectiveness.
PCB Specification
Parameter Details
Base Material Rogers RO3203 (ceramic-filled, woven fiberglass-reinforced PTFE composite)
Layer Count 2-Layer (rigid structure)
Board Dimensions 74.57mm x 23.28mm per piece (1PCS)
Minimum Trace/Space 4 mils (trace) / 7 mils (space)
Minimum Hole Size 0.2mm
Vias No blind vias; via plating thickness = 20 μm
Finished Board Thickness 0.35mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish ENEPIG
Silkscreen White silkscreen on top layer, no silkscreen on bottom layer
Solder Mask Green solder mask on top layer, no solder mask on bottom layer
Quality Assurance 100% electrical testing conducted prior to shipment
PCB Stack-up Configuration
Layer Name Material Thickness
Top Layer (Copper_layer_1) 35 μm thick copper 35 μm (1oz)
Substrate Layer Rogers RO3203 0.254mm (10mil)
Bottom Layer (Copper_layer_2) 35 μm thick copper 35 μm (1oz)
Rogers RO3203 Material Introduction
Rogers RO3203 is a premium high-frequency circuit material designed as an extension of the RO3000 Series, with a key focus on improved mechanical stability without compromising electrical performance. As a ceramic-filled laminate reinforced with woven fiberglass, it balances three critical attributes: exceptional electrical performance (suitable for frequencies beyond 40 GHz), robust mechanical stability, and competitive pricing—making it ideal for volume manufacturing of high-frequency devices.
Its core electrical properties—dielectric constant (Dk) of 3.02 and dissipation factor (DF) of 0.0016—enable reliable signal propagation at ultra-high frequencies, while its woven glass reinforcement ensures durability during handling and assembly. Unlike some high-frequency materials, RO3203 is also lead-free process compatible, aligning with global environmental standards.
Rogers PCB RO3203 Double-Layer 10mil ENEPIG Finish 0
RO3203 Key Features
Feature Specification
Material Composition Ceramic-filled PTFE composite (woven fiberglass-reinforced)
Dielectric Constant (Dk) 3.02 ± 0.04 at 10GHz/23°C
Dissipation Factor (DF) 0.0016 at 10GHz/23°C
Decomposition Temperature (Td) >500°C
Thermal Conductivity 0.87 W/mK
Coefficient of Thermal Expansion (CTE) X-axis: 13 ppm/°C; Y-axis: 13 ppm/°C; Z-axis: 58 ppm/°C (-55 to 288°C)
Process Compatibility Lead-free process compatible
Flammability Rating UL 94 V-0
Benefits
RO3203's properties translate to tangible advantages for the PCB, addressing key challenges in ultra-high-frequency design and volume manufacturing:
  • Ultra-High-Frequency Performance: Low DF (0.0016) and stable Dk (3.02 ± 0.04) enable reliable operation beyond 40 GHz.
  • Mechanical Stability: Woven glass reinforcement improves rigidity, making the PCB easier to handle during assembly and resistant to warpage.
  • Thermal Compatibility: Low in-plane CTE (13 ppm/°C for X/Y axes) matched to copper prevents solder joint failure during thermal cycling, supporting reliable surface-mounted assemblies.
  • Cost-Effectiveness: Economically priced for volume manufacturing, reducing total production costs without sacrificing high-frequency performance.
  • Surface Smoothness: Enables finer line etching tolerances for precise high-frequency circuit routing.
  • Safety & Compliance: UL 94 V-0 flammability rating and lead-free compatibility meet global safety and environmental standards.
Typical Applications
This PCB is designed for use in critical electronic systems, including:
  • Automotive: Collision avoidance systems, GPS antennas
  • Wireless Communications: Base station infrastructure, LMDS (Local Multipoint Distribution Service), wireless broadband, microstrip patch antennas
  • Satellite & Telecom: Direct broadcast satellites (DBS), wireless telecommunications systems, datalink on cable systems
  • Industrial & Consumer: Remote meter readers, power backplanes
Availability: Worldwide
This PCB is globally accessible for production and delivery, addressing the logistical needs of multi-region high-frequency projects.
Rogers PCB RO3203 Double-Layer 10mil ENEPIG Finish 1
Etiquetas: 

RO4003C LoPro Rogers PCB Board,  

8mil Rogers PCB Board,  

0.5oz Rogers PCB Board

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productos
DETALLES DE LOS PRODUCTOS
Productos

Tablero del PWB del RF

Tablero del PWB de Rogers

Tablero del PWB de PTFE

Alto PWB del Tg

PWB multi de la capa

PWB Taconic

Tablero del PWB de HDI

PWB de alta velocidad

La impedancia controló el PWB

Tablero flexible del PWB

tablero del PWB fr4

plantilla del PWB

PWB de la base del metal
Rogers PCB RO3203 Double-Layer 10mil ENEPIG Finish
  • Nombre
Rogers PCB RO3203 Double-Layer 10mil ENEPIG Finish
Cuota De Producción: 1 Uds.
Precio: USD9.99-99.99
Embalaje Estándar: Bolsas de vacío+cartones
Período De Entrega: 8-9 días hábiles
Método De Pago: T/T
Capacidad De Suministro: 5000pcs por mes
Información detallada
Descripción del Producto
Información detallada
Lugar de origen
Porcelana
Nombre de la marca
Bicheng
Certificación
UL, ISO9001, IATF16949
Número de modelo
BIC-332.V1.0
Material base:
ROGERS RO3203
Recuento de capas:
2 capas
Espesor de la PCB:
0.35 mm
Tamaño de PCB:
74,57 mm x 23,28 mm por pieza (1 unidad),
Platina:
Blanco
Máscara de soldadura:
Verde
Peso de cobre:
1 oz (1,4 mils) para capas exteriores
Acabado superficial:
ENEPIG
Cantidad de orden mínima:
1 Uds.
Precio:
USD9.99-99.99
Detalles de empaquetado:
Bolsas de vacío+cartones
Tiempo de entrega:
8-9 días hábiles
Condiciones de pago:
T/T
Capacidad de la fuente:
5000pcs por mes
Resaltar

Rogers RO3203 double-layer PCB

,

10mil ENEPIG finish PCB

,

Rogers PCB with ENEPIG coating

Descripción del Producto
Rogers PCB RO3203 Double-Layer 10mil ENEPIG Finish
This 2-layer rigid PCB is tailored for high-frequency applications (exceeding 40 GHz), leveraging Rogers RO3203—a ceramic-filled, woven fiberglass-reinforced laminate—to deliver exceptional signal integrity, mechanical stability, and cost-effectiveness.
PCB Specification
Parameter Details
Base Material Rogers RO3203 (ceramic-filled, woven fiberglass-reinforced PTFE composite)
Layer Count 2-Layer (rigid structure)
Board Dimensions 74.57mm x 23.28mm per piece (1PCS)
Minimum Trace/Space 4 mils (trace) / 7 mils (space)
Minimum Hole Size 0.2mm
Vias No blind vias; via plating thickness = 20 μm
Finished Board Thickness 0.35mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish ENEPIG
Silkscreen White silkscreen on top layer, no silkscreen on bottom layer
Solder Mask Green solder mask on top layer, no solder mask on bottom layer
Quality Assurance 100% electrical testing conducted prior to shipment
PCB Stack-up Configuration
Layer Name Material Thickness
Top Layer (Copper_layer_1) 35 μm thick copper 35 μm (1oz)
Substrate Layer Rogers RO3203 0.254mm (10mil)
Bottom Layer (Copper_layer_2) 35 μm thick copper 35 μm (1oz)
Rogers RO3203 Material Introduction
Rogers RO3203 is a premium high-frequency circuit material designed as an extension of the RO3000 Series, with a key focus on improved mechanical stability without compromising electrical performance. As a ceramic-filled laminate reinforced with woven fiberglass, it balances three critical attributes: exceptional electrical performance (suitable for frequencies beyond 40 GHz), robust mechanical stability, and competitive pricing—making it ideal for volume manufacturing of high-frequency devices.
Its core electrical properties—dielectric constant (Dk) of 3.02 and dissipation factor (DF) of 0.0016—enable reliable signal propagation at ultra-high frequencies, while its woven glass reinforcement ensures durability during handling and assembly. Unlike some high-frequency materials, RO3203 is also lead-free process compatible, aligning with global environmental standards.
Rogers PCB RO3203 Double-Layer 10mil ENEPIG Finish 0
RO3203 Key Features
Feature Specification
Material Composition Ceramic-filled PTFE composite (woven fiberglass-reinforced)
Dielectric Constant (Dk) 3.02 ± 0.04 at 10GHz/23°C
Dissipation Factor (DF) 0.0016 at 10GHz/23°C
Decomposition Temperature (Td) >500°C
Thermal Conductivity 0.87 W/mK
Coefficient of Thermal Expansion (CTE) X-axis: 13 ppm/°C; Y-axis: 13 ppm/°C; Z-axis: 58 ppm/°C (-55 to 288°C)
Process Compatibility Lead-free process compatible
Flammability Rating UL 94 V-0
Benefits
RO3203's properties translate to tangible advantages for the PCB, addressing key challenges in ultra-high-frequency design and volume manufacturing:
  • Ultra-High-Frequency Performance: Low DF (0.0016) and stable Dk (3.02 ± 0.04) enable reliable operation beyond 40 GHz.
  • Mechanical Stability: Woven glass reinforcement improves rigidity, making the PCB easier to handle during assembly and resistant to warpage.
  • Thermal Compatibility: Low in-plane CTE (13 ppm/°C for X/Y axes) matched to copper prevents solder joint failure during thermal cycling, supporting reliable surface-mounted assemblies.
  • Cost-Effectiveness: Economically priced for volume manufacturing, reducing total production costs without sacrificing high-frequency performance.
  • Surface Smoothness: Enables finer line etching tolerances for precise high-frequency circuit routing.
  • Safety & Compliance: UL 94 V-0 flammability rating and lead-free compatibility meet global safety and environmental standards.
Typical Applications
This PCB is designed for use in critical electronic systems, including:
  • Automotive: Collision avoidance systems, GPS antennas
  • Wireless Communications: Base station infrastructure, LMDS (Local Multipoint Distribution Service), wireless broadband, microstrip patch antennas
  • Satellite & Telecom: Direct broadcast satellites (DBS), wireless telecommunications systems, datalink on cable systems
  • Industrial & Consumer: Remote meter readers, power backplanes
Availability: Worldwide
This PCB is globally accessible for production and delivery, addressing the logistical needs of multi-region high-frequency projects.
Rogers PCB RO3203 Double-Layer 10mil ENEPIG Finish 1
Etiquetas: 

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan, Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
Mapa del Sitio |  Política de privacidad | China es buena. Calidad Tablero del PWB del RF Proveedor. Derecho de autor 2020-2025 Bicheng Electronics Technology Co., Ltd Todo. Todos los derechos reservados.