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LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
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LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
  • Nombre

LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided

Cuota De Producción: 1 Uds.
Precio: USD9.99-99.99
Embalaje Estándar: Bolsas de vacío+cartones
Período De Entrega: 8-9 días hábiles
Método De Pago: T/T
Capacidad De Suministro: 5000pcs por mes
Detalles Información
Descripción del Producto
Información detallada
Lugar de origen
Porcelana
Nombre de la marca
Bicheng
Certificación
UL, ISO9001, IATF16949
Número de modelo
BIC-332.V1.0
Material base:
Rogers RO4003C Perfil bajo (LoPro)
Recuento de capas:
2 capas
Espesor de la PCB:
0.65 mm
Tamaño de PCB:
64 mm x 68,4 mm por pieza (1 unidad)
Platina:
Blanco
Máscara de soldadura:
Verde
Peso de cobre:
1 oz (1,4 mils) para capas exteriores
Acabado superficial:
Recubrimiento de plata + baño de oro
Resaltar:

Rogers PCB board 20.7mil substrate

,

Double-sided LoPro RO4003C PCB

,

Rogers PCB with high-frequency performance

Descripción del Producto
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
This two-layer PCB is meticulously crafted for high-frequency radio frequency (RF) and high-speed digital applications. It utilizes Rogers RO4003C Low Profile (LoPro) material, a hydrocarbon ceramic laminate featuring proprietary reverse-treated foil technology. This combination enables the PCB to achieve superior signal integrity, minimize conductor losses, and ensure cost-efficient manufacturing processes.
PCB Specification
Parameter Details
Base Material Rogers RO4003C Low Profile (LoPro) - Hydrocarbon ceramic laminate with reverse-treated foil
Layer Count 2-Layer (rigid structure)
Board Dimensions 64mm x 68.4mm per piece (1PCS)
Minimum Trace/Space 5 mils (trace) / 5 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; via plating thickness = 20 μm
Finished Board Thickness 0.65mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Silver underplating + Gold plating
Silkscreen White silkscreen on top layer, no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing conducted prior to shipment
Rogers RO4003C Low Profile Material Introduction
Rogers RO4003C Low Profile (LoPro) is a game-changing hydrocarbon ceramic laminate that redefines cost-effective high-performance PCB design. Its core innovation lies in proprietary reverse-treated foil technology: this allows the foil to bond directly to standard RO4003C dielectric, creating a laminate with drastically reduced conductor loss--while preserving all the desirable attributes of standard RO4003C (e.g., low dielectric loss, FR-4 process compatibility).
Unlike traditional high-frequency materials (e.g., PTFE-based laminates) that require specialized via preparation (e.g., sodium etch), RO4003C LoPro works with standard epoxy/glass (FR-4) fabrication processes. This eliminates extra manufacturing steps, slashes costs, and makes it accessible to most PCB factories. It's designed to bridge the gap between high-performance RF materials and cost-effective digital substrates, making it ideal for mixed-signal applications.
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided 0
RO4003C Low Profile Key Features
Feature Specification
Material Composition Hydrocarbon ceramic laminate with reverse-treated foil
Dielectric Constant (Dk) 3.38 ± 0.05 at 10GHz/23°C
Dissipation Factor (DF) 0.0027 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >425°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.64 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 11 ppm/°C
- Y-axis: 14 ppm/°C
- Z-axis: 46 ppm/°C (-55 to 288°C)
Process Compatibility Lead-free process compatible; standard FR-4 fabrication compatible
Additional Attribute CAF (Conductive Anodic Filament) resistant
Material Benefits
RO4003C LoPro's properties translate to tangible advantages for the PCB, solving key challenges in high-speed/RF design and cost-sensitive manufacturing:
  • Ultra-Low Insertion Loss: Reduced conductor loss enables reliable operation beyond 40 GHz.
  • Minimized Passive Intermodulation (PIM): Low PIM levels prevent signal distortion in high-power RF systems.
  • FR-4 Process Compatibility: Uses standard fabrication workflows (no specialized via treatment) to cut manufacturing costs and lead times.
  • Thermal Resilience: High Tg (>280°C) and Td (>425°C) withstand lead-free soldering and high-temperature operating environments.
  • Copper-Matched CTE: X/Y-axis CTE (11/14 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling.
  • CAF Resistance: Protects against conductive anodic filament formation.
  • Design Flexibility: Supports both multi-layer PCBs (for complex digital circuits) and 2-layer designs, adapting to diverse project needs.
Some Typical Applications
  • Digital applications such as servers, routers, and high speed back planes
  • Cellular base station antennas and power amplifiers
  • LNB's for direct broadcast satellites
  • RF Identification Tags
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided 1
Etiquetas: 

RO4003C LoPro Rogers PCB Board,  

8mil Rogers PCB Board,  

0.5oz Rogers PCB Board

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productos
DETALLES DE LOS PRODUCTOS
Productos

Tablero del PWB del RF

Tablero del PWB de Rogers

Tablero del PWB de PTFE

Alto PWB del Tg

PWB multi de la capa

PWB Taconic

Tablero del PWB de HDI

PWB de alta velocidad

La impedancia controló el PWB

Tablero flexible del PWB

tablero del PWB fr4

plantilla del PWB

PWB de la base del metal
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
  • Nombre
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
Cuota De Producción: 1 Uds.
Precio: USD9.99-99.99
Embalaje Estándar: Bolsas de vacío+cartones
Período De Entrega: 8-9 días hábiles
Método De Pago: T/T
Capacidad De Suministro: 5000pcs por mes
Información detallada
Descripción del Producto
Información detallada
Lugar de origen
Porcelana
Nombre de la marca
Bicheng
Certificación
UL, ISO9001, IATF16949
Número de modelo
BIC-332.V1.0
Material base:
Rogers RO4003C Perfil bajo (LoPro)
Recuento de capas:
2 capas
Espesor de la PCB:
0.65 mm
Tamaño de PCB:
64 mm x 68,4 mm por pieza (1 unidad)
Platina:
Blanco
Máscara de soldadura:
Verde
Peso de cobre:
1 oz (1,4 mils) para capas exteriores
Acabado superficial:
Recubrimiento de plata + baño de oro
Cantidad de orden mínima:
1 Uds.
Precio:
USD9.99-99.99
Detalles de empaquetado:
Bolsas de vacío+cartones
Tiempo de entrega:
8-9 días hábiles
Condiciones de pago:
T/T
Capacidad de la fuente:
5000pcs por mes
Resaltar

Rogers PCB board 20.7mil substrate

,

Double-sided LoPro RO4003C PCB

,

Rogers PCB with high-frequency performance

Descripción del Producto
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
This two-layer PCB is meticulously crafted for high-frequency radio frequency (RF) and high-speed digital applications. It utilizes Rogers RO4003C Low Profile (LoPro) material, a hydrocarbon ceramic laminate featuring proprietary reverse-treated foil technology. This combination enables the PCB to achieve superior signal integrity, minimize conductor losses, and ensure cost-efficient manufacturing processes.
PCB Specification
Parameter Details
Base Material Rogers RO4003C Low Profile (LoPro) - Hydrocarbon ceramic laminate with reverse-treated foil
Layer Count 2-Layer (rigid structure)
Board Dimensions 64mm x 68.4mm per piece (1PCS)
Minimum Trace/Space 5 mils (trace) / 5 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; via plating thickness = 20 μm
Finished Board Thickness 0.65mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Silver underplating + Gold plating
Silkscreen White silkscreen on top layer, no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing conducted prior to shipment
Rogers RO4003C Low Profile Material Introduction
Rogers RO4003C Low Profile (LoPro) is a game-changing hydrocarbon ceramic laminate that redefines cost-effective high-performance PCB design. Its core innovation lies in proprietary reverse-treated foil technology: this allows the foil to bond directly to standard RO4003C dielectric, creating a laminate with drastically reduced conductor loss--while preserving all the desirable attributes of standard RO4003C (e.g., low dielectric loss, FR-4 process compatibility).
Unlike traditional high-frequency materials (e.g., PTFE-based laminates) that require specialized via preparation (e.g., sodium etch), RO4003C LoPro works with standard epoxy/glass (FR-4) fabrication processes. This eliminates extra manufacturing steps, slashes costs, and makes it accessible to most PCB factories. It's designed to bridge the gap between high-performance RF materials and cost-effective digital substrates, making it ideal for mixed-signal applications.
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided 0
RO4003C Low Profile Key Features
Feature Specification
Material Composition Hydrocarbon ceramic laminate with reverse-treated foil
Dielectric Constant (Dk) 3.38 ± 0.05 at 10GHz/23°C
Dissipation Factor (DF) 0.0027 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >425°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.64 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 11 ppm/°C
- Y-axis: 14 ppm/°C
- Z-axis: 46 ppm/°C (-55 to 288°C)
Process Compatibility Lead-free process compatible; standard FR-4 fabrication compatible
Additional Attribute CAF (Conductive Anodic Filament) resistant
Material Benefits
RO4003C LoPro's properties translate to tangible advantages for the PCB, solving key challenges in high-speed/RF design and cost-sensitive manufacturing:
  • Ultra-Low Insertion Loss: Reduced conductor loss enables reliable operation beyond 40 GHz.
  • Minimized Passive Intermodulation (PIM): Low PIM levels prevent signal distortion in high-power RF systems.
  • FR-4 Process Compatibility: Uses standard fabrication workflows (no specialized via treatment) to cut manufacturing costs and lead times.
  • Thermal Resilience: High Tg (>280°C) and Td (>425°C) withstand lead-free soldering and high-temperature operating environments.
  • Copper-Matched CTE: X/Y-axis CTE (11/14 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling.
  • CAF Resistance: Protects against conductive anodic filament formation.
  • Design Flexibility: Supports both multi-layer PCBs (for complex digital circuits) and 2-layer designs, adapting to diverse project needs.
Some Typical Applications
  • Digital applications such as servers, routers, and high speed back planes
  • Cellular base station antennas and power amplifiers
  • LNB's for direct broadcast satellites
  • RF Identification Tags
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided 1
Etiquetas: 

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan, Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
Mapa del Sitio |  Política de privacidad | China es buena. Calidad Tablero del PWB del RF Proveedor. Derecho de autor 2020-2025 Bicheng Electronics Technology Co., Ltd Todo. Todos los derechos reservados.