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FR408HR PCB 6-layer 1.6mm Thick Blue Solder-mask Immersion Gold

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FR408HR PCB 6-layer 1.6mm Thick Blue Solder-mask Immersion Gold

Cuota De Producción:	1 Uds.
Precio:	USD9.99-99.99
Embalaje Estándar:	Bolsas de vacío + cajas de cartón
Período De Entrega:	8-9 días laborables
Método De Pago:	T/T
Capacidad De Suministro:	5000PCS por mes

Detalles Información

Descripción del Producto

Información detallada

Lugar de origen

Porcelana

Nombre de la marca

Bicheng

Certificación

UL, ISO9001, IATF16949

Número de modelo

BIC-470.V1.0

Materia prima:

Laminado FR408HR

Recuento de capas:

6 Capas

Espesor de PCB:

1.60m m

Tamaño de placa de circuito impreso:

79 mm x 105 mm por unidad

Máscara de soldadura:

Serigrafía:

Blanco

Peso de cobre:

1 oz por capa

Acabado superficial:

Oro de inmersión

Resaltar:

6-layer FR408HR PCB

1.6mm thick immersion gold PCB

blue solder-mask multilayer PCB

Descripción del Producto

This PCB is a high-performance 6-layer board fabricated with FR408HR laminate. As a high-performance FR-4 resin system, FR408HR possesses excellent thermal, electrical, and mechanical properties, making it highly suitable for multilayer PCB applications that require maximum thermal performance and operational reliability.

PCB Specification

Item	Specifications
Base Material	FR408HR Laminate
Layer Count	6 layers (multilayer PCB)
Board Dimensions	79mm x 105mm per unit, 1 piece total
Finished Board Thickness	1.60mm (laminated thickness)
Finished Copper Weight	1 oz per layer
Surface Finish	Immersion Gold
Top/Bottom Solder Mask	Blue solder mask with white silkscreen (top and bottom)
Additional Processing	Resin plugging for holes with diameter 0.2mm-0.4mm

PCB Stack-up

Layer No.	Description	Thickness
1	Copper Layer — L1 (Outer Top)	0.035 mm
2	Prepreg FR408HR 2116 (58%)	Standard Prepreg Thickness
3	Prepreg FR408HR 2116 (58%)	Standard Prepreg Thickness
4	Copper Layer — L2	0.035 mm
5	Core FR408HR	0.25 mm
6	Copper Layer — L3	0.035 mm
7	Prepreg FR408HR 2116 (58%)	Standard Prepreg Thickness
8	Prepreg FR408HR 2116 (58%)	Standard Prepreg Thickness
9	Copper Layer — L4	0.035 mm
10	Core FR408HR	0.25 mm
11	Copper Layer — L5	0.035 mm
12	Prepreg FR408HR 2116 (58%)	Standard Prepreg Thickness
13	Prepreg FR408HR 2116 (58%)	Standard Prepreg Thickness
14	Copper Layer — L6 (Outer Bottom)	0.035 mm
Total Pressed Thickness		1.544 mm

FR408HR PCB 6-layer 1.6mm Thick Blue Solder-mask Immersion Gold 0

Introduction to FR408HR Material

FR408HR laminate and prepreg products are manufactured with Isola’s patented high-performance multifunctional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 30% improvement in Z-axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. These properties, coupled with superior moisture resistance at reflow, result in a product that bridges the gap from both a thermal and electrical perspective.

FR408HR Material Properties & Features

Property	Typical Value	Units (Metric/English)	Test Method (IPC-TM-650 or as noted)
Glass Transition Temperature (Tg) by DSC	190	°C	2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss	360	°C	2.4.24.6
Time to Delaminate by TMA (Copper removed) A. T260 B. T288	60 >30	Minutes	2.4.24.1
Z-Axis CTE A. Pre-Tg B. Post-Tg C. 50 to 260°C (Total Expansion)	55 230 2.8	ppm/°C ppm/°C %	2.4.24C
X/Y-Axis CTE (Pre-Tg)	16	ppm/°C	2.4.24C
Thermal Conductivity	0.4	W/m·K	ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF) A. Unetched B. Etched	Pass	Pass Visual	2.4.13.1
Dk, Permittivity A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz	3.72 3.69 3.68 3.64 3.65	—	2.5.5.3; 2.5.5.9; Bereskin Stripline
Df, Loss Tangent A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz	0.0072 0.0091 0.0092 0.0098 0.0095	—	2.5.5.3; 2.5.5.9; Bereskin Stripline
Volume Resistivity A. After moisture resistance B. At elevated temperature	4.4 x 10⁷ 9.4 x 10⁷	MΩ-cm	2.5.17.1
Surface Resistivity A. After moisture resistance B. At elevated temperature	2.6 x 10⁶ 2.1 x 10⁸	MΩ	2.5.17.1
Dielectric Breakdown	>50	kV	2.5.6B
Arc Resistance	137	Seconds	2.5.1B
Electric Strength (Laminate & laminated prepreg)	70 (1741)	kV/mm (V/mil)	2.5.6.2A
Comparative Tracking Index (CTI)	2 (250-399)	Class (Volts)	UL 746A; ASTM D3638
Peel Strength A. Low/very low profile copper foil (>17μm) B. Standard profile copper 1. After thermal stress 2. After process solutions	1.14 (6.5) 0.96 (5.5) 0.90 (5.1)	N/mm (lb/inch)	2.4.8C; 2.4.8.2A; 2.4.8.3
Flexural Strength A. Length direction B. Cross direction	72.5 58.0	ksi	2.4.4B
Tensile Strength A. Length direction B. Cross direction	54.5 38.7	ksi	ASTM D3039
Young's Modulus A. Length direction B. Cross direction	3695 3315	ksi	ASTM D790-15e2
Poisson's Ratio A. Length direction B. Cross direction	0.137 0.133	—	ASTM D3039
Moisture Absorption	0.061	%	2.6.2.1A
Flammability (Laminate & laminated prepreg)	V-0	Rating	UL 94
Relative Thermal Index (RTI)	130	°C	UL 796

Typical Applications of FR408HR PCB

-High-density 6-layer PCBs

-Lead-free assembly electronic products

-Devices requiring multiple reflow cycles (up to 6x 260°C)

-Equipment with 0.8mm pitch components and small-diameter holes

-Electronic systems demanding superior moisture resistance and structural stability

-Products compatible with AOI and optical positioning systems

Artwork, Quality Standard and Availability

This PCB's artwork is provided in the industry-standard Gerber RS-274-X format, compatible with mainstream production equipment and design software. It complies with recognized industry standards, ensuring consistent electrical performance, reliable manufacturing quality, and suitability for high-reliability applications. This PCB is available worldwide to meet the needs of international customers and high-performance circuit projects.

Conclusion

Due to FR408HR’s superior thermal stability, excellent electrical performance, CAF resistance, lead-free assembly compatibility, and FR-4 process adaptability, the 6-layer PCB has become the optimal choice for professionals and project teams engaged in high-density, high-reliability electronic projects that demand stable performance, precise processing, and long-term durability.

FR408HR PCB 6-layer 1.6mm Thick Blue Solder-mask Immersion Gold 1

Etiquetas:

Productos

Cuota De Producción:	1 Uds.
Precio:	USD9.99-99.99
Embalaje Estándar:	Bolsas de vacío + cajas de cartón
Período De Entrega:	8-9 días laborables
Método De Pago:	T/T
Capacidad De Suministro:	5000PCS por mes

Información detallada

Descripción del Producto

Información detallada

Lugar de origen

Porcelana

Nombre de la marca

Bicheng

Certificación

UL, ISO9001, IATF16949

Número de modelo

BIC-470.V1.0

Materia prima:

Laminado FR408HR

Recuento de capas:

6 Capas

Espesor de PCB:

1.60m m

Tamaño de placa de circuito impreso:

79 mm x 105 mm por unidad

Máscara de soldadura:

azul

Serigrafía:

Blanco

Peso de cobre:

1 oz por capa

Acabado superficial:

Oro de inmersión

Cantidad de orden mínima:

1 Uds.

Precio:

USD9.99-99.99

Detalles de empaquetado:

Bolsas de vacío + cajas de cartón

Tiempo de entrega:

8-9 días laborables

Condiciones de pago:

T/T

Capacidad de la fuente:

5000PCS por mes

Resaltar

6-layer FR408HR PCB

1.6mm thick immersion gold PCB

blue solder-mask multilayer PCB

Descripción del Producto

PCB Specification

Item	Specifications
Base Material	FR408HR Laminate
Layer Count	6 layers (multilayer PCB)
Board Dimensions	79mm x 105mm per unit, 1 piece total
Finished Board Thickness	1.60mm (laminated thickness)
Finished Copper Weight	1 oz per layer
Surface Finish	Immersion Gold
Top/Bottom Solder Mask	Blue solder mask with white silkscreen (top and bottom)
Additional Processing	Resin plugging for holes with diameter 0.2mm-0.4mm

PCB Stack-up

Layer No.	Description	Thickness
1	Copper Layer — L1 (Outer Top)	0.035 mm
2	Prepreg FR408HR 2116 (58%)	Standard Prepreg Thickness
3	Prepreg FR408HR 2116 (58%)	Standard Prepreg Thickness
4	Copper Layer — L2	0.035 mm
5	Core FR408HR	0.25 mm
6	Copper Layer — L3	0.035 mm
7	Prepreg FR408HR 2116 (58%)	Standard Prepreg Thickness
8	Prepreg FR408HR 2116 (58%)	Standard Prepreg Thickness
9	Copper Layer — L4	0.035 mm
10	Core FR408HR	0.25 mm
11	Copper Layer — L5	0.035 mm
12	Prepreg FR408HR 2116 (58%)	Standard Prepreg Thickness
13	Prepreg FR408HR 2116 (58%)	Standard Prepreg Thickness
14	Copper Layer — L6 (Outer Bottom)	0.035 mm
Total Pressed Thickness		1.544 mm

FR408HR PCB 6-layer 1.6mm Thick Blue Solder-mask Immersion Gold 0

Introduction to FR408HR Material

FR408HR Material Properties & Features

Property	Typical Value	Units (Metric/English)	Test Method (IPC-TM-650 or as noted)
Glass Transition Temperature (Tg) by DSC	190	°C	2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss	360	°C	2.4.24.6
Time to Delaminate by TMA (Copper removed) A. T260 B. T288	60 >30	Minutes	2.4.24.1
Z-Axis CTE A. Pre-Tg B. Post-Tg C. 50 to 260°C (Total Expansion)	55 230 2.8	ppm/°C ppm/°C %	2.4.24C
X/Y-Axis CTE (Pre-Tg)	16	ppm/°C	2.4.24C
Thermal Conductivity	0.4	W/m·K	ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF) A. Unetched B. Etched	Pass	Pass Visual	2.4.13.1
Dk, Permittivity A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz	3.72 3.69 3.68 3.64 3.65	—	2.5.5.3; 2.5.5.9; Bereskin Stripline
Df, Loss Tangent A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz	0.0072 0.0091 0.0092 0.0098 0.0095	—	2.5.5.3; 2.5.5.9; Bereskin Stripline
Volume Resistivity A. After moisture resistance B. At elevated temperature	4.4 x 10⁷ 9.4 x 10⁷	MΩ-cm	2.5.17.1
Surface Resistivity A. After moisture resistance B. At elevated temperature	2.6 x 10⁶ 2.1 x 10⁸	MΩ	2.5.17.1
Dielectric Breakdown	>50	kV	2.5.6B
Arc Resistance	137	Seconds	2.5.1B
Electric Strength (Laminate & laminated prepreg)	70 (1741)	kV/mm (V/mil)	2.5.6.2A
Comparative Tracking Index (CTI)	2 (250-399)	Class (Volts)	UL 746A; ASTM D3638
Peel Strength A. Low/very low profile copper foil (>17μm) B. Standard profile copper 1. After thermal stress 2. After process solutions	1.14 (6.5) 0.96 (5.5) 0.90 (5.1)	N/mm (lb/inch)	2.4.8C; 2.4.8.2A; 2.4.8.3
Flexural Strength A. Length direction B. Cross direction	72.5 58.0	ksi	2.4.4B
Tensile Strength A. Length direction B. Cross direction	54.5 38.7	ksi	ASTM D3039
Young's Modulus A. Length direction B. Cross direction	3695 3315	ksi	ASTM D790-15e2
Poisson's Ratio A. Length direction B. Cross direction	0.137 0.133	—	ASTM D3039
Moisture Absorption	0.061	%	2.6.2.1A
Flammability (Laminate & laminated prepreg)	V-0	Rating	UL 94
Relative Thermal Index (RTI)	130	°C	UL 796

Typical Applications of FR408HR PCB

-High-density 6-layer PCBs

-Lead-free assembly electronic products

-Devices requiring multiple reflow cycles (up to 6x 260°C)

-Equipment with 0.8mm pitch components and small-diameter holes

-Electronic systems demanding superior moisture resistance and structural stability

-Products compatible with AOI and optical positioning systems

Artwork, Quality Standard and Availability

Conclusion

FR408HR PCB 6-layer 1.6mm Thick Blue Solder-mask Immersion Gold 1

Etiquetas:

Tablero del PWB del RF

Tablero del PWB de Rogers

Tablero del PWB de PTFE

Alto PWB del Tg

PWB multi de la capa

PWB Taconic

Tablero del PWB de HDI

PWB de alta velocidad

La impedancia controló el PWB

Tablero flexible del PWB

tablero del PWB fr4

plantilla del PWB

PWB de la base del metal

Laminados revestidos de cobre

FR408HR PCB 6-layer 1.6mm Thick Blue Solder-mask Immersion Gold

6-layer FR408HR PCB

1.6mm thick immersion gold PCB

blue solder-mask multilayer PCB

PWB multi de la capa 2OZ,

4 capas de la placa de circuito de múltiples capas,

Tablero del PWB del RF

Tablero del PWB de Rogers

Tablero del PWB de PTFE

Alto PWB del Tg

PWB multi de la capa

PWB Taconic

Tablero del PWB de HDI

PWB de alta velocidad

La impedancia controló el PWB

Tablero flexible del PWB

tablero del PWB fr4

plantilla del PWB

PWB de la base del metal

Laminados revestidos de cobre

6-layer FR408HR PCB

1.6mm thick immersion gold PCB

blue solder-mask multilayer PCB

PWB multi de la capa 2OZ,

4 capas de la placa de circuito de múltiples capas,