| Cuota De Producción: | 1 por ciento |
| Precio: | USD9.99-99.99 |
| Embalaje Estándar: | Bolsas de vacío+cartones |
| Período De Entrega: | 8-9 días hábiles |
| Método De Pago: | T/T |
| Capacidad De Suministro: | 5000pcs por mes |
| Construction Detail | Specification |
|---|---|
| Base material | DiClad 870 |
| Layer count | 2-layer |
| Board dimensions | 83mm x 35mm (1 piece), +/- 0.15mm |
| Minimum Trace/Space | 5/9 mils |
| Minimum Hole Size | 0.3mm |
| Finished board thickness | 2.5mm |
| Finished Cu weight | Outer layers: 1 oz (1.4 mils) |
| Via plating thickness | 20 μm |
| Surface finish | Immersion gold |
| Silkscreen | No |
| Solder Mask | No |
| Quality assurance (prior to shipment) | 100% Electrical test |
| Layer/Material | Thickness Specification |
|---|---|
| Copper_layer_1 | 35 μm |
| DiClad 870 Core | 2.362mm (93mil) |
| Copper_layer_2 | 35 μm |
| Cuota De Producción: | 1 por ciento |
| Precio: | USD9.99-99.99 |
| Embalaje Estándar: | Bolsas de vacío+cartones |
| Período De Entrega: | 8-9 días hábiles |
| Método De Pago: | T/T |
| Capacidad De Suministro: | 5000pcs por mes |
| Construction Detail | Specification |
|---|---|
| Base material | DiClad 870 |
| Layer count | 2-layer |
| Board dimensions | 83mm x 35mm (1 piece), +/- 0.15mm |
| Minimum Trace/Space | 5/9 mils |
| Minimum Hole Size | 0.3mm |
| Finished board thickness | 2.5mm |
| Finished Cu weight | Outer layers: 1 oz (1.4 mils) |
| Via plating thickness | 20 μm |
| Surface finish | Immersion gold |
| Silkscreen | No |
| Solder Mask | No |
| Quality assurance (prior to shipment) | 100% Electrical test |
| Layer/Material | Thickness Specification |
|---|---|
| Copper_layer_1 | 35 μm |
| DiClad 870 Core | 2.362mm (93mil) |
| Copper_layer_2 | 35 μm |