Cuota De Producción: | 1 por ciento |
Precio: | USD9.99-99.99 |
Embalaje Estándar: | Bolsas de vacío+cartones |
Período De Entrega: | 8-9 días hábiles |
Método De Pago: | T/T |
Capacidad De Suministro: | 5000pcs por mes |
Construction Detail | Specification |
---|---|
Base material | DiClad 870 |
Layer count | 2-layer |
Board dimensions | 83mm x 35mm (1 piece), +/- 0.15mm |
Minimum Trace/Space | 5/9 mils |
Minimum Hole Size | 0.3mm |
Finished board thickness | 2.5mm |
Finished Cu weight | Outer layers: 1 oz (1.4 mils) |
Via plating thickness | 20 μm |
Surface finish | Immersion gold |
Silkscreen | No |
Solder Mask | No |
Quality assurance (prior to shipment) | 100% Electrical test |
Layer/Material | Thickness Specification |
---|---|
Copper_layer_1 | 35 μm |
DiClad 870 Core | 2.362mm (93mil) |
Copper_layer_2 | 35 μm |
Cuota De Producción: | 1 por ciento |
Precio: | USD9.99-99.99 |
Embalaje Estándar: | Bolsas de vacío+cartones |
Período De Entrega: | 8-9 días hábiles |
Método De Pago: | T/T |
Capacidad De Suministro: | 5000pcs por mes |
Construction Detail | Specification |
---|---|
Base material | DiClad 870 |
Layer count | 2-layer |
Board dimensions | 83mm x 35mm (1 piece), +/- 0.15mm |
Minimum Trace/Space | 5/9 mils |
Minimum Hole Size | 0.3mm |
Finished board thickness | 2.5mm |
Finished Cu weight | Outer layers: 1 oz (1.4 mils) |
Via plating thickness | 20 μm |
Surface finish | Immersion gold |
Silkscreen | No |
Solder Mask | No |
Quality assurance (prior to shipment) | 100% Electrical test |
Layer/Material | Thickness Specification |
---|---|
Copper_layer_1 | 35 μm |
DiClad 870 Core | 2.362mm (93mil) |
Copper_layer_2 | 35 μm |