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2-layer Polyimide PCB 0.12mm Flexible pcb with ENIG 0.5oz

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2-layer Polyimide PCB 0.12mm Flexible pcb with ENIG 0.5oz

Cuota De Producción:	1 Uds.
Precio:	USD9.99-99.99
Embalaje Estándar:	Bolsas de vacío+cartones
Período De Entrega:	8-9 días hábiles
Método De Pago:	T/T
Capacidad De Suministro:	5000 unidades por mes

Detalles Información

Descripción del Producto

Información detallada

Lugar de origen

Porcelana

Nombre de la marca

Bicheng

Certificación

UL, ISO9001, IATF16949

Número de modelo

BIC-332.V1.0

Materia prima:

Poliimida sin adhesivo

Recuento de capas:

2 capas

Espesor de la PCB:

0.12m m

Tamaño de PCB:

110 mm × 130 mm

Platina:

blanco

Máscara de soldadura:

verde

Peso de cobre:

0,5 oz para capas exteriores

Acabado superficial:

Resaltar:

ENIG 2-layer Polyimide PCB

0.12mm 2-layer Polyimide PCB

Descripción del Producto

This 2-layer flexible PCB is engineered for high-reliability flexible electronic applications, leveraging adhesiveless polyimide (SF202 series FCCL) material. It is specifically designed to meet the requirements of high-frequency signal transmission and dynamic bending scenarios, balancing superior performance and practicality for use cases ranging from foldable mobile phones to automotive electronics.

PCB Specification

Parameter	Details
Layer Count	2-Layer (flexible structure)
Base Material	Adhesiveless Polyimide (SF202 series adhesiveless double-sided flexible copper-clad laminate)
Board Dimensions	110mm × 130mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space	8 mils (trace) / 6 mils (space)
Minimum Hole Size	0.2mm
Vias	No blind vias; total vias: 51; via plating thickness: 15 μm
Finished Board Thickness	0.12mm
Finished Copper Weight	0.5oz (0.7 mils) for outer layers
Surface Finish	Electroless Nickle Immersion Gold (ENIG)
Silkscreen	White on top layer; no silkscreen on bottom layer
Solder Mask	Green on both top and bottom layers
Quality Assurance	100% electrical testing before shipment

PCB Stack-up

Layer Name	Material	Thickness
Top Layer (Copper_layer_1)	Copper	22 μm
Substrate Layer	SF305 Polyimide Core	0.05mm (50 μm)
Bottom Layer (Copper_layer_2)	Copper	22 μm

Core Material Introduction (SF202 Adhesiveless PI Film Based FCCL)

SF202 is an adhesiveless double-sided flexible copper-clad laminate (FCCL) developed by Shengyi Technology for high-reliability flexible electronic devices. It is tailored for high-frequency signal transmission and dynamic bending applications, ideal for fields with strict FPC requirements such as foldable mobile phones, computers, digital cameras, VCRs, flat panel displays, automotive electronics, and precision instruments. Its core advantages include low dielectric loss, high bending resistance, and excellent dimensional stability.

Key Advantages of SF202 Material:

FR-4 Process Compatibility: Adaptable to standard flexible PCB fabrication workflows, reducing manufacturing costs and lead times

Adhesiveless Design: Enhances flexibility and bending resistance while reducing overall board thickness

Environmental Compliance: Halogen-free, UL 94 V-0 rated, and RoHS compliant (free of Pb, Hg, Cd, Cr6+, PBB, PBDE)

2-layer Polyimide PCB 0.12mm Flexible pcb with ENIG 0.5oz 0

Key Material Features

Feature	Specification/Description
Dielectric Constant (Dk)	3.2 at 1 GHz (tested per IPC-TM-650 standard)
Dissipation Factor	0.007 at 1 GHz (tested per IPC-TM-650 standard)
90° Peel Strength	≥1 N/mm
Chemical Resistance	≥80%
Moisture Absorption	≤1.5%
Dielectric Strength	150 V/μm
Flammability Rating	UL 94 V-0 (material) / UL 94 VTM-0 (PCB)
Comprehensive Performance	Excellent flexibility, thermal resistance, dimensional stability, and electrical performance
Soldering & Chemical Performance	Superior soldering reliability and chemical resistance

Core Benefits

-Low Dielectric Loss: Ensures reliable high-frequency signal transmission, critical for communication devices like mobile phones and digital cameras

-High Bending Resistance: Adapts to dynamic bending scenarios, ideal for foldable electronics and automotive moving parts

-Thermal Resilience: Withstands high-temperature operating environments and lead-free soldering processes

-Dimensional Stability: Minimizes deformation during fabrication and operation, ensuring long-term reliability

-Environmental Safety: Halogen-free and RoHS compliant, meeting global sustainability standards

Quality Standard & Availability

Quality Standard: Complies with IPC-Class-2 quality standards. IPC-Class-2 is a widely recognized industry standard for printed circuit boards, specifying requirements for acceptability that ensure reliable performance in general electronic applications.

Availability: Worldwide supply is supported.

Typical Applications

-Consumer Electronics: Computers, mobile phones (especially foldable models), digital cameras, VCRs

-Automotive Electronics: Various in-vehicle electronic components

-Office Equipment: Office automation devices

-Other Fields: Flat panel displays, precision instruments, and other high-reliability flexible electronic devices

2-layer Polyimide PCB 0.12mm Flexible pcb with ENIG 0.5oz 1

Etiquetas:

Polyimide 25um Flexible PCB Board,

Polyimide Stiffener 2 Oz Copper PCB,

2 Oz Copper 4 Layer Flex PCB

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Laminados revestidos de cobre

2-layer Polyimide PCB 0.12mm Flexible pcb with ENIG 0.5oz

Cuota De Producción:	1 Uds.
Precio:	USD9.99-99.99
Embalaje Estándar:	Bolsas de vacío+cartones
Período De Entrega:	8-9 días hábiles
Método De Pago:	T/T
Capacidad De Suministro:	5000 unidades por mes

Información detallada

Descripción del Producto

Información detallada

Lugar de origen

Porcelana

Nombre de la marca

Bicheng

Certificación

UL, ISO9001, IATF16949

Número de modelo

BIC-332.V1.0

Materia prima:

Poliimida sin adhesivo

Recuento de capas:

2 capas

Espesor de la PCB:

0.12m m

Tamaño de PCB:

110 mm × 130 mm

Platina:

blanco

Máscara de soldadura:

verde

Peso de cobre:

0,5 oz para capas exteriores

Acabado superficial:

Enig

Cantidad de orden mínima:

1 Uds.

Precio:

USD9.99-99.99

Detalles de empaquetado:

Bolsas de vacío+cartones

Tiempo de entrega:

8-9 días hábiles

Condiciones de pago:

T/T

Capacidad de la fuente:

5000 unidades por mes

Resaltar

ENIG 2-layer Polyimide PCB

0.12mm 2-layer Polyimide PCB

Descripción del Producto

PCB Specification

Parameter	Details
Layer Count	2-Layer (flexible structure)
Base Material	Adhesiveless Polyimide (SF202 series adhesiveless double-sided flexible copper-clad laminate)
Board Dimensions	110mm × 130mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space	8 mils (trace) / 6 mils (space)
Minimum Hole Size	0.2mm
Vias	No blind vias; total vias: 51; via plating thickness: 15 μm
Finished Board Thickness	0.12mm
Finished Copper Weight	0.5oz (0.7 mils) for outer layers
Surface Finish	Electroless Nickle Immersion Gold (ENIG)
Silkscreen	White on top layer; no silkscreen on bottom layer
Solder Mask	Green on both top and bottom layers
Quality Assurance	100% electrical testing before shipment

PCB Stack-up

Layer Name	Material	Thickness
Top Layer (Copper_layer_1)	Copper	22 μm
Substrate Layer	SF305 Polyimide Core	0.05mm (50 μm)
Bottom Layer (Copper_layer_2)	Copper	22 μm

Core Material Introduction (SF202 Adhesiveless PI Film Based FCCL)

Key Advantages of SF202 Material:

FR-4 Process Compatibility: Adaptable to standard flexible PCB fabrication workflows, reducing manufacturing costs and lead times

Adhesiveless Design: Enhances flexibility and bending resistance while reducing overall board thickness

Environmental Compliance: Halogen-free, UL 94 V-0 rated, and RoHS compliant (free of Pb, Hg, Cd, Cr6+, PBB, PBDE)

2-layer Polyimide PCB 0.12mm Flexible pcb with ENIG 0.5oz 0

Key Material Features

Feature	Specification/Description
Dielectric Constant (Dk)	3.2 at 1 GHz (tested per IPC-TM-650 standard)
Dissipation Factor	0.007 at 1 GHz (tested per IPC-TM-650 standard)
90° Peel Strength	≥1 N/mm
Chemical Resistance	≥80%
Moisture Absorption	≤1.5%
Dielectric Strength	150 V/μm
Flammability Rating	UL 94 V-0 (material) / UL 94 VTM-0 (PCB)
Comprehensive Performance	Excellent flexibility, thermal resistance, dimensional stability, and electrical performance
Soldering & Chemical Performance	Superior soldering reliability and chemical resistance

Core Benefits

-Low Dielectric Loss: Ensures reliable high-frequency signal transmission, critical for communication devices like mobile phones and digital cameras

-High Bending Resistance: Adapts to dynamic bending scenarios, ideal for foldable electronics and automotive moving parts

-Thermal Resilience: Withstands high-temperature operating environments and lead-free soldering processes

-Dimensional Stability: Minimizes deformation during fabrication and operation, ensuring long-term reliability

-Environmental Safety: Halogen-free and RoHS compliant, meeting global sustainability standards

Quality Standard & Availability

Availability: Worldwide supply is supported.

Typical Applications

-Consumer Electronics: Computers, mobile phones (especially foldable models), digital cameras, VCRs

-Automotive Electronics: Various in-vehicle electronic components

-Office Equipment: Office automation devices

-Other Fields: Flat panel displays, precision instruments, and other high-reliability flexible electronic devices

2-layer Polyimide PCB 0.12mm Flexible pcb with ENIG 0.5oz 1

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