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High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish

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High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish

Cuota De Producción:	1 por ciento
Precio:	USD9.99-99.99
Embalaje Estándar:	Bolsas de vacío+cartones
Período De Entrega:	8-9 días hábiles
Método De Pago:	T/T
Capacidad De Suministro:	5000pcs por mes

Detalles Información

Descripción del Producto

Información detallada

Lugar de origen

PORCELANA

Nombre de la marca

Bicheng

Certificación

UL, ISO9001, IATF16949

Número de modelo

BIC-052.V1.0

Material base:

ROGERS RO4730G3

Recuento de capas:

2 capas

Espesor de la PCB:

0,6mm

Tamaño de PCB:

59,6 mm x 40,5 mm (

Peso de cobre:

1oz (equivalente a 1.4 mils o 35 μm)

Acabado superficial:

Gold de inmersión de níquel electroales (Enig)

Resaltar:

2-layer RF PCB RO4730G3

ENIG finish Rogers PCB

high-frequency Rogers PCB board

Descripción del Producto

High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish

This is a high-quality, double-sided PCB engineered for radio frequency (RF) applications, particularly suited for antenna systems. It is fabricated using Rogers RO4730G3 antenna-grade laminate, ensuring superior electrical performance, reliability, and cost-effectiveness.

1. PCB Specifications

Specification Category	Details
Base Material	Rogers RO4730G3 (hydrocarbon/ceramic laminate) – Low-loss, high-frequency substrate; robust and economical alternative to traditional PTFE-based substrates.
Layer Count	2 layers
Physical Dimensions	- Board size: 59.6mm x 40.5mm (1 piece)- Dimensional tolerance: ±0.15mm
Design Rules – Traces & Holes	- Minimum Trace/Space: 5 mil / 5 mil- Minimum Drill Size: 0.4mm
Design Rules – Vias	- Via Type: Through-hole vias only (no blind vias)- Via Plating Thickness: 20 μm
Board Thickness	Finished board thickness: 0.6 mm
Copper Weight	1 oz (equivalent to 35 μm) on both outer layers
Surface Finish	Electroless Nickel Immersion Gold (ENIG) – Provides a flat, solderable surface with excellent oxidation resistance; optimized for RF performance.
Solder Mask	- Top side: Green (LPI, Liquid Photoimageable) solder mask- Bottom side: No solder mask (exposed copper)
Silkscreen	- Top side: White legend silkscreen- Bottom side: No silkscreen

2. PCB Stack-up

Layer Position	Material	Thickness
Top Layer	35 μm Copper	35 μm (1oz)
Core Layer	Rogers RO4730G3	0.508mm (20mil)
Bottom Layer	35 μm Copper	35 μm (1oz)

High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish 0

3. Key Material Features & Benefits (RO4730G3):

The use of Rogers RO4730G3 material provides significant advantages for RF designs:

-Optimized RF Performance: Stable dielectric constant (Dk) of 3.00 ± 0.05 at 10 GHz and an ultra-low dissipation factor of 0.0028 for reduced insertion loss.

-Low Passive Intermodulation (PIM): Ideal for cellular base station antennas where signal integrity is critical.

-Excellent Thermal Stability: High Tg >280°C and a low Thermal Coefficient of Dk (34 ppm/°C) ensure consistent electrical performance across temperature variations.

-Ease of Fabrication: Fully compatible with standard FR-4 multi-layer processing and lead-free assembly, eliminating the need for specialized PTFE treatments.

-Lightweight & Robust: Unique filler system makes the material 30% lighter than PTFE/glass and features a CTE matched to copper for enhanced reliability.

-Environmental Compliance: RoHS compliant and compatible with lead-free soldering processes.

Characteristic Category	Technical Specification
Stable Dielectric Constant (Dk)	3.00 ± 0.05 at 10 GHz
Ultra-Low Signal Loss	Dissipation factor of 0.0028 at 10 GHz
Superior Thermal Stability (TCDk)	Thermal Coefficient of Dk: 34 ppm/°C
High Thermal Resilience	- Glass Transition Temperature (Tg): >280°C- Decomposition Temperature (Td): 411°C (TGA)
Controlled Thermal Expansion (CTE)	- X-axis: 15.9 ppm/°C- Y-axis: 14.4 ppm/°C- Z-axis: 35.2 ppm/°C
Efficient Heat Dissipation	Thermal Conductivity: 0.45 W/mK

4. Typical Applications:

This PCB is ideally suited for:

-Cellular Base Station Antennas

-Various other RF and antenna applications requiring stable electrical performance and low loss.

Quality & Testing: Manufactured to IPC-Class-2 standards and undergoes 100% electrical testing prior to shipment to ensure functionality and reliability.

Artwork Format: Gerber RS-274-X– the universal industry standard, compatible with fabrication facilities worldwide.

Availability: This PCB is available for order and shipment worldwide.

High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish 1

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High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish

Cuota De Producción:	1 por ciento
Precio:	USD9.99-99.99
Embalaje Estándar:	Bolsas de vacío+cartones
Período De Entrega:	8-9 días hábiles
Método De Pago:	T/T
Capacidad De Suministro:	5000pcs por mes

Información detallada

Descripción del Producto

Información detallada

Lugar de origen

PORCELANA

Nombre de la marca

Bicheng

Certificación

UL, ISO9001, IATF16949

Número de modelo

BIC-052.V1.0

Material base:

ROGERS RO4730G3

Recuento de capas:

2 capas

Espesor de la PCB:

0,6mm

Tamaño de PCB:

59,6 mm x 40,5 mm (

Peso de cobre:

1oz (equivalente a 1.4 mils o 35 μm)

Acabado superficial:

Gold de inmersión de níquel electroales (Enig)

Cantidad de orden mínima:

1 por ciento

Precio:

USD9.99-99.99

Detalles de empaquetado:

Bolsas de vacío+cartones

Tiempo de entrega:

8-9 días hábiles

Condiciones de pago:

T/T

Capacidad de la fuente:

5000pcs por mes

Resaltar

2-layer RF PCB RO4730G3

ENIG finish Rogers PCB

high-frequency Rogers PCB board

Descripción del Producto

High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish

1. PCB Specifications

Specification Category	Details
Base Material	Rogers RO4730G3 (hydrocarbon/ceramic laminate) – Low-loss, high-frequency substrate; robust and economical alternative to traditional PTFE-based substrates.
Layer Count	2 layers
Physical Dimensions	- Board size: 59.6mm x 40.5mm (1 piece)- Dimensional tolerance: ±0.15mm
Design Rules – Traces & Holes	- Minimum Trace/Space: 5 mil / 5 mil- Minimum Drill Size: 0.4mm
Design Rules – Vias	- Via Type: Through-hole vias only (no blind vias)- Via Plating Thickness: 20 μm
Board Thickness	Finished board thickness: 0.6 mm
Copper Weight	1 oz (equivalent to 35 μm) on both outer layers
Surface Finish	Electroless Nickel Immersion Gold (ENIG) – Provides a flat, solderable surface with excellent oxidation resistance; optimized for RF performance.
Solder Mask	- Top side: Green (LPI, Liquid Photoimageable) solder mask- Bottom side: No solder mask (exposed copper)
Silkscreen	- Top side: White legend silkscreen- Bottom side: No silkscreen

2. PCB Stack-up

Layer Position	Material	Thickness
Top Layer	35 μm Copper	35 μm (1oz)
Core Layer	Rogers RO4730G3	0.508mm (20mil)
Bottom Layer	35 μm Copper	35 μm (1oz)

High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish 0

3. Key Material Features & Benefits (RO4730G3):

The use of Rogers RO4730G3 material provides significant advantages for RF designs:

-Optimized RF Performance: Stable dielectric constant (Dk) of 3.00 ± 0.05 at 10 GHz and an ultra-low dissipation factor of 0.0028 for reduced insertion loss.

-Low Passive Intermodulation (PIM): Ideal for cellular base station antennas where signal integrity is critical.

-Excellent Thermal Stability: High Tg >280°C and a low Thermal Coefficient of Dk (34 ppm/°C) ensure consistent electrical performance across temperature variations.

-Ease of Fabrication: Fully compatible with standard FR-4 multi-layer processing and lead-free assembly, eliminating the need for specialized PTFE treatments.

-Lightweight & Robust: Unique filler system makes the material 30% lighter than PTFE/glass and features a CTE matched to copper for enhanced reliability.

-Environmental Compliance: RoHS compliant and compatible with lead-free soldering processes.

Characteristic Category	Technical Specification
Stable Dielectric Constant (Dk)	3.00 ± 0.05 at 10 GHz
Ultra-Low Signal Loss	Dissipation factor of 0.0028 at 10 GHz
Superior Thermal Stability (TCDk)	Thermal Coefficient of Dk: 34 ppm/°C
High Thermal Resilience	- Glass Transition Temperature (Tg): >280°C- Decomposition Temperature (Td): 411°C (TGA)
Controlled Thermal Expansion (CTE)	- X-axis: 15.9 ppm/°C- Y-axis: 14.4 ppm/°C- Z-axis: 35.2 ppm/°C
Efficient Heat Dissipation	Thermal Conductivity: 0.45 W/mK

4. Typical Applications:

This PCB is ideally suited for:

-Cellular Base Station Antennas

-Various other RF and antenna applications requiring stable electrical performance and low loss.

Quality & Testing: Manufactured to IPC-Class-2 standards and undergoes 100% electrical testing prior to shipment to ensure functionality and reliability.

Artwork Format: Gerber RS-274-X– the universal industry standard, compatible with fabrication facilities worldwide.

Availability: This PCB is available for order and shipment worldwide.

High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish 1

Etiquetas: