F4BM217 Copper Clad Pcb Material Laminate 460X610mm 500X600mm 850X120mm 914X1220mm 1000X1200mm

Wangling's F4BM217 is a high-performance composite laminate engineered for advanced RF and microwave applications. It is manufactured through a precise formulation and lamination process, combining woven fiberglass cloth with PTFE resin and film to achieve superior and consistent electrical properties.

This next-generation material offers significant performance enhancements over its predecessor, F4B220, featuring lower dielectric loss, higher insulation resistance, and improved overall stability. F4BM217 serves as a reliable, high-quality domestic alternative to comparable imported laminates.

Key Material Variants:
The core dielectric formulation is available in two copper foil configurations to suit specific application needs:

F4BM217: Utilizes standard Electrodeposited (ED) copper foil. This variant is a cost-effective solution for general high-frequency applications where Passive Intermodulation (PIM) is not a critical requirement.

F4BME217: Pairs the same dielectric with Reverse-Treated Foil (RTF) copper. This combination delivers excellent PIM performance, enables more precise line definition, and reduces conductor loss for demanding, high-precision circuits.

Tailored Performance through Material Science:
The electrical and mechanical properties of F4BM217 are precisely tuned by adjusting the ratio of PTFE to fiberglass cloth within the composite. This allows for controlled dielectric constants while maintaining low loss characteristics and enhanced dimensional stability.

A higher dielectric constant is achieved by increasing the fiberglass content, which improves dimensional stability, lowers the thermal expansion coefficient, and reduces temperature drift.

This adjustment involves a balanced trade-off, as a higher fiberglass ratio may result in a marginal increase in dielectric loss.

This design flexibility enables engineers to select the optimal material grade for a perfect balance of electrical performance, mechanical robustness, and processing requirements.

Typical Application Cases

-Microwave, RF, and Radar

-Phase Shifters, Passive Components

-Power Dividers, Couplers, Combiners

-Feed Networks, Phased Array Antennas

-Satellite Communication, Base Station Antennas